Automated Assembly of Radiation Imaging Tiles
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Solution Overview
Problem
The manual assembly of CdTe or CdZnTe imaging hybrids for x-ray and gamma-ray imaging panels is labor-intensive, limits production volume, and increases costs, while also compromising on image quality due to human error in alignment and dicing accuracy.
Innovation Solution
An automated or semiautomatic manufacturing method using computer-controlled machines and mechanical pick-and-place devices to align and position hybrids on a mounting substrate with predetermined gap settings between edges, utilizing alignment marks on either the ASIC or the detector, ensuring a gap of approximately one pixel width to prevent electrical shorts and maintain image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual assembly is used to position and assemble hybrids on the mother board, then flexibility and adaptability are maintained, but productivity is low and manufacturing precision is compromised due to human error
Solution Approach 1:
The patent replaces manual mechanical assembly operations with an automated pick-and-place machine that uses computer vision and automated picking mechanisms to position hybrids on the mother board, thereby increasing productivity while maintaining precision through automated control systems
Solution Approach 2:
The alignment marks on the mother board and hybrids enable the automated system to self-align components without human intervention, with the machine automatically detecting mark positions and adjusting hybrid placement accordingly to achieve precise positioning
2Manufacturing precision
If manual alignment is performed under a microscope, then image quality can be monitored, but manufacturing precision is limited by dicing accuracy and human observation capabilities
Solution Approach 1:
The patent replaces manual visual alignment under a microscope with an automated vision system that uses alignment marks and computer-controlled positioning to achieve superior alignment precision, eliminating limitations of human observation and dicing accuracy
Solution Approach 2:
The patent introduces alignment marks as intermediary reference features on both the mother board and hybrids, which serve as mediators for the automated vision system to accurately determine positions and orientations without directly measuring the sensitive detector edges
3Manufacturing precision
If the gap between hybrids is minimized to improve image quality, then image fidelity improves, but the risk of electrical shorts increases due to dicing inaccuracies
Solution Approach 1:
The patent pre-establishes a controlled gap distance between hybrids during the automated placement process, based on predetermined coordinates derived from alignment marks, ensuring adequate electrical isolation is maintained while minimizing the gap to preserve image quality
Solution Approach 2:
The automated vision system measures the actual positions of alignment marks and hybrids, provides feedback to the control system, which then adjusts the placement coordinates to achieve the optimal gap distance that balances image quality and electrical isolation requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly enhances throughput, accuracy, and reliability of the assembly process, reducing production costs while maintaining high image quality by ensuring precise alignment and maintaining a controlled gap between hybrids, which is crucial for preventing electrical shorts and maintaining image fidelity.
Implementation Method 1
CdTe and CdZnTe are well known to be x-ray imaging detectors of high sensitivity, which directly convert x-rays (or gamma rays) to electronic signal
Data Source
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AI summary
An automatic or semiautomatic method of assembly of radiation digital imaging tiles (30, 31, 32) to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s) (13), inherent or specific, and a mother board (20) or substrate is also provide with alignment mark(s) (21) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances (x1, x2, x3, y1, y2, y3) of corresponding alignment mark are set to predetermined values, programmed in the automatic machine.