Auxiliary Electrode via Hole in OLED Encapsulation
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Solution Overview
Problem
Existing electroluminescent display devices face issues with high power consumption and overheating due to the high impedance of thin metal or metal oxide top electrodes, leading to decreased display performance and shortened service life.
Innovation Solution
A display panel design that includes a thin-film transistor, an electroluminescent diode with a bottom and top electrode, and a thin-film encapsulation layer, where an auxiliary electrode is electrically connected to the top electrode's lead wire by penetrating through the encapsulation layer, reducing overall resistance and power consumption, and featuring a 3-layer thin-film encapsulation structure with inorganic and organic layers to enhance encapsulation quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If thin metal or metal oxide top electrodes are used, then the display device achieves light and thin design, but the impedance increases leading to high power consumption and overheating
Solution Approach 1:
The top electrode is segmented into multiple layers with different materials (first top electrode layer with low work function material, second top electrode layer with high work function material), allowing each layer to contribute different properties that collectively reduce impedance while maintaining thin design
Solution Approach 2:
The top electrode uses composite material structure combining different metal or metal oxide materials with complementary properties, where the combination achieves lower overall impedance than single-material thin electrodes, reducing power consumption and overheating
2Weight of moving object
If thin metal or metal oxide top electrodes are used, then the display device achieves light and thin design, but the impedance increases leading to overheating and decreased service life
Solution Approach 1:
The top electrode is divided into multiple functional layers that distribute electrical and thermal stress, preventing localized overheating and degradation that would reduce service life
Solution Approach 2:
Composite material structure provides both electrical conductivity and thermal management properties, enhancing reliability by preventing overheating-related failures while maintaining thin profile
3Loss of energy
If a via hole is formed through the thin-film encapsulation layer to connect the auxiliary electrode, then the overall resistance is reduced, but the encapsulation layer may develop cracks leading to encapsulation failure
Solution Approach 1:
A filling material is deposited into the via hole to cushion and distribute mechanical stress around the via hole, preventing crack propagation that would compromise encapsulation integrity while allowing the auxiliary electrode to function for reducing power consumption
Solution Approach 2:
The filling material acts as an intermediary between the via hole structure and the encapsulation layer, absorbing mechanical stress and preventing direct stress concentration that would cause cracks, thus protecting encapsulation quality while enabling the resistance-reducing auxiliary electrode connection
Data Source
AI summary
The present disclosure discloses a display panel, which includes a thin-film transistor arranged on a substrate, an electroluminescent diode arranged on the thin-film transistor, which includes a bottom electrode, a light emitting layer, and a top electrode, and a thin-film encapsulation layer covering the electroluminescent diode. The display panel further includes an auxiliary electrode and a lead wire of the top electrode of the electroluminescent diode. The auxiliary electrode is electrically connected to the lead wire of the top electrode of the electroluminescent diode by penetrating through a via hole of the thin-film encapsulation layer. Arrangements of the present disclosure provide a display panel and a manufacturing method thereof and a display device including the display panel.