Auxiliary Electrode for Uniform Plating Thickness
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Solution Overview
Problem
Existing jet flow-type plating apparatuses face challenges in establishing a sufficient electrical connection between the metal pipe electrode and the plated area of the targets, leading to longer times for achieving the desired plating thickness and potential unevenness in the plated film thickness.
Innovation Solution
The introduction of an auxiliary electrode electrically connected to the metal pipe electrode within the plating forming portion assists in establishing a reliable electrical connection, reducing the time required to achieve the desired plating thickness and ensuring uniform current distribution to minimize thickness variations in the plated film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number and amount of media are increased to establish sufficient electrical connection, then the electrical connection between the metal pipe electrode and plated area is improved, but the electric field may be shielded by the media resulting in longer time for film formation or thickness variation
Solution Approach 1:
The patent introduces an auxiliary electrode as an intermediary component between the metal pipe electrode and the plated area. This auxiliary electrode provides an additional conductive path that enhances electrical connection without requiring excessive media, thereby avoiding electric field shielding while ensuring reliable current transmission to the plated surface.
Solution Approach 2:
The electrical connection system is segmented into multiple pathways: the original path through media and the new path through the auxiliary electrode. This segmentation allows the system to achieve sufficient electrical connection through the auxiliary electrode without over-relying on media, thus preventing electric field shielding and reducing plating time.
2Reliability
If the number and amount of media are increased to establish sufficient electrical connection, then the electrical connection between the metal pipe electrode and plated area is improved, but thickness variation in plated film increases
Solution Approach 1:
The auxiliary electrode serves as a controlled intermediary that provides consistent electrical connection without the variability introduced by excessive media. This leads to more uniform current distribution across the plated area, thereby improving thickness uniformity of the plated film.
Solution Approach 2:
The auxiliary electrode provides localized electrical connection at specific positions within the plating forming portion, ensuring uniform current distribution to the plated area. This localized approach complements the media-based connection and improves overall thickness uniformity.
3Reliability
If media are used to establish electrical connection, then current can be transmitted to plated area, but the electric field may be shielded by the media
Solution Approach 1:
The auxiliary electrode acts as a superior intermediary that transmits electrical current without causing electric field shielding. Unlike media that can block and scatter electric fields, the auxiliary electrode provides a clean, direct conductive path that maintains electric field integrity while ensuring reliable current transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The auxiliary electrode significantly reduces the time needed to achieve the desired plating thickness and minimizes thickness variations in the plated film, resulting in more efficient and uniform plating processes.
Implementation Method 1
a current is applied between the metal pipe defining and functioning as the first electrode and the second electrode to form a plated film on a plated area on the surface of each plating target
Implementation Method 2
An injection unit is provided below the metal pipe. The injection unit serves to generate an upward flow of the plating solution inside the metal pipe. In other words, in the apparatus disclosed in Japanese Patent Laid-Open No. 2021-138999, the injection unit serves as a source that generates a jet flow in the plating solution.
Data Source
AI summary
A plating apparatus includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an insulating material, and a second electrode. The metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe.