Back Cover UV Tape Bonding for Reliable Bezel Assembly
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Solution Overview
Problem
Existing methods for adhering a middle bezel to a back cover in electronic devices face challenges with connection reliability and assembly complexity, particularly due to the use of pressure-sensitive tapes and hot-melt adhesives, which result in poor connection strength and high processing costs.
Innovation Solution
The use of an ultraviolet-curing tape layer with shear strengths greater than or equal to 1.5 MPa between the back cover and middle bezel, allowing for simplified assembly through photocuring activation and lamination, ensuring strong adhesive strength and reducing assembly difficulty.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pressure-sensitive tape is used to adhere the middle bezel to the back cover, then assembly is convenient and processing costs are low, but adhesive strength is poor resulting in poor connection reliability
Solution Approach 1:
The patent changes the adhesive material parameters by using ultraviolet-curing adhesive instead of pressure-sensitive tape, achieving both high connection reliability (shear strength ≥1.5 MPa) and assembly convenience through UV curing process
2Reliability
If hot-melt adhesive is used to adhere the middle bezel to the back cover, then connection reliability is improved, but assembly process becomes complex and processing costs increase
Solution Approach 1:
The patent replaces the mechanical heating and curing process of hot-melt adhesive with a UV light curing process, eliminating the need for heating equipment and complex process control while maintaining high connection reliability
Solution Approach 2:
The patent changes the curing mechanism from thermal curing to photochemical curing, simplifying the assembly process while achieving the required shear strength of ≥1.5 MPa between the middle bezel and back cover
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ultraviolet-curing tape layer enhances connection reliability between the back cover and middle bezel, simplifies the assembly process, reduces processing costs, and improves repair efficiency while maintaining a thin and lightweight design.
Implementation Method 1
the back cover is fixedly adhered to the middle bezel by using the ultraviolet-curing tape layer
Data Source
AI summary
This application discloses an electronic device and an assembly method for the electronic device. The electronic device includes a middle bezel, a back cover, and an ultraviolet-curing tape layer, where the back cover is disposed on a side of the middle bezel, the back cover includes a substrate and an ink layer, and the ink layer is disposed on a side surface that is of the substrate and that faces the middle bezel; and the back cover is fixedly adhered to the middle bezel by using the ultraviolet-curing tape layer, the ultraviolet-curing tape layer is connected between the ink layer and the middle bezel, shear strength between the ultraviolet-curing tape layer and the ink layer is greater than or equal to 1.5 MPa, and shear strength between the ultraviolet-curing tape layer and the middle bezel is greater than or equal to 1.5 MPa.