Back-Molded Camera Module Layout for Smaller Imaging Assemblies
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Solution Overview
Problem
Current camera modules in electronic devices face challenges in reducing size while maintaining imaging quality, as the arrangement of photosensitive chips and passive electronic components leads to increased module size, hindering the development of thinner and more intelligent devices.
Innovation Solution
A camera module design where electronic components are placed on the back face of the substrate, with a molding unit that embeds and isolates components to prevent interference, allowing for a more compact structure and improved heat dissipation, and eliminating the need for external connections, thus reducing the module's length and width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a related art image-capturing module is used, then the module can capture images, but the module cannot be disposed of after use due to contamination risk
Solution Approach 1:
The image-capturing module is segmented into a reusable main body and a disposable holder. The holder contains the imaging element and is designed to be discarded after use, while the main body can be reused. This segmentation allows the contamination risk to be isolated to the disposable holder, eliminating the need to dispose of the entire module while maintaining contamination prevention.
Solution Approach 2:
The imaging element is extracted from its original housing and placed into a separate disposable holder. This extraction allows the holder to be designed as a standalone disposable unit that can be easily attached to and removed from the reusable module body, enabling selective disposal of only the contaminated holder portion.
2Reliability
If a disposable holder with imaging element is used, then contamination can be prevented by discarding the holder, but the holder must be precisely positioned on the circuit board
Solution Approach 1:
The holder is designed with specific local features including positioning protrusions that fit into corresponding recesses on the circuit board. These localized positioning features ensure precise alignment and positioning of the holder without requiring high-precision manufacturing across the entire holder structure, making the positioning process more forgiving and easier to manufacture.
Solution Approach 2:
The positioning protrusions and recesses act as intermediary elements between the holder and circuit board. These intermediary features facilitate precise positioning by providing mechanical guidance and alignment, reducing the need for high-precision manufacturing while ensuring accurate placement of the imaging element.
3Reliability
If the imaging element is held by a holder, then the module can be disposed of after use, but the holder increases the overall module size
Solution Approach 1:
The imaging element is nested within the holder, which itself is designed to fit within or attach to the reusable module body. This nested structure allows the holder to provide disposal functionality while minimizing its external dimensions, as the holder's volume is optimized to contain only the essential imaging element without excessive material usage.
Solution Approach 2:
The holder is designed with a thin-walled, lightweight structure that provides sufficient mechanical support for the imaging element while minimizing material usage and overall volume. The holder uses thin film or shell construction to achieve the necessary structural integrity with reduced dimensions, allowing disposability without significantly increasing module size.
Data Source
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AI summary
The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.