Back Pan Cooling Assembly for Electronic Displays

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Electronic displays used in various applications face challenges in heat management due to their standard sizes and components, which can lead to overheating, especially when used in environments requiring different ancillary services, as traditional cooling solutions do not effectively address the unique thermal needs of these displays.

Innovation Solution

A cooling back pan assembly is positioned behind the rear pan of an electronic display with a fan creating an air gap for ambient air flow, allowing for effective cooling of both the rear and cooling back pans, while keeping sensitive components protected from dust and contaminants by maintaining sealed thermal communication with conductive components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional cooling solutions are used for electronic displays, then the standard components can be maintained, but the heat management effectiveness deteriorates leading to overheating

Engineering Contradiction:
Improveheat management effectivenessVSAvoidoperational reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent divides the cooling system into separate functional zones: a first cooling area for electronic components and a second cooling area for the rear housing. This segmentation allows targeted cooling of different thermal sources, improving heat management effectiveness while maintaining operational reliability through specialized cooling for each component type.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a reflective barrier as an intermediary element positioned between the light source and the rear housing. This barrier reflects light away from the housing, preventing thermal energy transfer and improving heat management by isolating thermal zones, thereby maintaining operational reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If ambient air is used for cooling electronic components, then cooling effectiveness is improved, but sensitive components are exposed to dust and contaminants

Engineering Contradiction:
Improvecooling effectivenessVSAvoiddust and contaminants exposure
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent creates a sealed enclosure for sensitive electronic components, separating them from the ambient environment. This segmentation allows the use of ambient air for cooling external components (improving cooling effectiveness) while the sealed enclosure protects sensitive components from dust and contaminants (reducing harmful factor exposure).

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses a reflective barrier as an intermediary that redirects ambient air flow patterns. The barrier positions cool air streams to pass over heat-generating components while preventing direct air flow into sealed enclosures containing sensitive components. This intermediary structure enables effective cooling of exposed components without exposing protected components to contaminants.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution efficiently cools electronic components by utilizing ambient air flow through the gap between the rear and cooling back pans, effectively managing heat without exposing sensitive components to ambient air, thus enhancing the operational reliability and longevity of electronic displays in diverse applications.

Implementation Method 1

A fan is preferably positioned so as to cause a flow of ambient air through the gap, cooling the rear pan and the cooling back pan

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

Electronic components for operating the electronic display can be mounted to the cooling back pan and preferably are placed in conductive thermal communication with the cooling back pan

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

A fan is preferably positioned so as to cause a flow of ambient air through the gap, cooling the rear pan and the cooling back pan

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10660245B2Back pan cooling assembly for electronic display
Publication Date: 2020.05.19 MANUFACTURING RESOURCES INTERNATIONAL INC
  • US10660245B2 patent drawing
  • US10660245B2 patent drawing

AI summary

Exemplary embodiments disclosed herein provide a back pan cooling assembly for an electronic display having a rear pan. A cooling back pan is preferably positioned behind the rear pan, the space between the cooling back pan and the rear pan defining a gap. A fan is positioned to cause a flow of ambient air through the gap. An electronic component for driving the electronic display may be placed in conductive thermal communication with the cooling back pan. A rear cover can be placed against the cooling back pan to define a sealed compartment which does not permit ambient air to enter. A port can be provided within the rear cover which allows ambient air to travel between the surroundings, the fan, and the gap.