Patterned distribution plate and siphon wall ensure uniform flow distribution, preventing overheating in immersion cooling systems.
Multiple cooling pumps distribute coolant through a serial pipeline to maintain uniform flow across heat dissipating components.
A dome camera bottom housing couples a metal sub-plate to a plastic main body for efficient thermal conduction.
A hybrid liquid cooling system combines immersion and direct loops to manage thermal loads in integrated circuits.
A recycle pump returns leaked coolant from a collection pan to the inlet manifold in hot-swappable server cooling systems.
Programmable variable valves dynamically adjust opening degrees to compensate for fluidic channel friction losses and maintain uniform coolant distribution.
An electro-osmotic pump circulates coolant through a core with integrated channels.
Segmented filters and stabilizers in an immersion cooling tank preserve fluid purity while minimizing vibration-induced instability.
A hybrid cooling design integrates liquid and air mechanisms within fully enclosed electronics enclosures.
Sliding pedestals in the cold plate adjust to component height variations, reducing thermal impedance and preventing damage from excessive pressure.
A heat pipe transfers thermal energy from data center ambient air to a fluid interface using phase transition principles.
Internal heat exchange via a cover plate cooling channel reduces heat transfer fluid volume and leakage risk in server enclosures.
Integrated filter device removes solid particles from cooling fluid, enabling quick maintenance access without detaching the entire unit.
A redundant cooling system uses single phase and unified plates with separate coolant loops to dissipate heat from high-density server electronics.
A vented and ducted sub-rack support member redirects airflow through integrated vents to increase velocity, resolving compact PXI module cooling bottlenecks.
A bidirectional fan assembly reverses airflow direction across electronic components to optimize cooling.
Segmented transparent gas chambers remove heat from high-brightness displays without compromising image quality or reliability.
Roller-equipped tracks allow cooling units to move along overhead rails, eliminating disruptive ceiling mounts and maintaining operational continuity.
Pyrolytic graphite plates transfer backlight heat to the chassis, resolving slim device overheating without adding bulky fans.
An integrated rack architecture distributes two-phase coolant directly to submerged servers.
Thermally conductive chassis and heat transferring unit move chip heat to ambient environment without active cooling components.
Segmented branch pumps overcome uneven fluid flow caused by varying pipeline lengths in centralized cooling systems.
Sliding shields adjust blanking panel height to prevent heated air recirculation into equipment intakes.
Auxiliary tank overflow and pump refilling maintain stable liquid levels, preventing status light obstruction while ensuring effective heat dissipation.