Cooling/Ventilation/Heating Modifications TRIZ Cases

Patterned distribution plate and siphon wall ensure uniform flow distribution, preventing overheating in immersion cooling systems.

Multiple cooling pumps distribute coolant through a serial pipeline to maintain uniform flow across heat dissipating components.

A dome camera bottom housing couples a metal sub-plate to a plastic main body for efficient thermal conduction.

A hybrid liquid cooling system combines immersion and direct loops to manage thermal loads in integrated circuits.

A recycle pump returns leaked coolant from a collection pan to the inlet manifold in hot-swappable server cooling systems.

Programmable variable valves dynamically adjust opening degrees to compensate for fluidic channel friction losses and maintain uniform coolant distribution.

An electro-osmotic pump circulates coolant through a core with integrated channels.

Segmented filters and stabilizers in an immersion cooling tank preserve fluid purity while minimizing vibration-induced instability.

A hybrid cooling design integrates liquid and air mechanisms within fully enclosed electronics enclosures.

Sliding pedestals in the cold plate adjust to component height variations, reducing thermal impedance and preventing damage from excessive pressure.

A heat pipe transfers thermal energy from data center ambient air to a fluid interface using phase transition principles.

Internal heat exchange via a cover plate cooling channel reduces heat transfer fluid volume and leakage risk in server enclosures.

Integrated filter device removes solid particles from cooling fluid, enabling quick maintenance access without detaching the entire unit.

A redundant cooling system uses single phase and unified plates with separate coolant loops to dissipate heat from high-density server electronics.

A vented and ducted sub-rack support member redirects airflow through integrated vents to increase velocity, resolving compact PXI module cooling bottlenecks.

A bidirectional fan assembly reverses airflow direction across electronic components to optimize cooling.

Segmented transparent gas chambers remove heat from high-brightness displays without compromising image quality or reliability.

Roller-equipped tracks allow cooling units to move along overhead rails, eliminating disruptive ceiling mounts and maintaining operational continuity.

Pyrolytic graphite plates transfer backlight heat to the chassis, resolving slim device overheating without adding bulky fans.

An integrated rack architecture distributes two-phase coolant directly to submerged servers.

Thermally conductive chassis and heat transferring unit move chip heat to ambient environment without active cooling components.

Segmented branch pumps overcome uneven fluid flow caused by varying pipeline lengths in centralized cooling systems.

Sliding shields adjust blanking panel height to prevent heated air recirculation into equipment intakes.

Auxiliary tank overflow and pump refilling maintain stable liquid levels, preventing status light obstruction while ensuring effective heat dissipation.

A thermal-activated switch connects a heat exchanger to a heat pipe, enabling passive heat dissipation without external power or fans.

An air deflection cabinet redirects warm exhaust from equipment cabinets to a top vent.

Flow management sustains elevated coolant temperatures to reject heat directly to ambient air without refrigeration cycles.

A dual-walled electronics cabinet uses thermally conductive materials to transfer heat from an internal space to the external environment.

A chassis side vent redirects main airflow through the power supply unit region, increasing airflow by 20% to 33% in dense rack configurations.

A segmentation strategy isolates the condenser from electronics to prevent water splashing damage while maintaining cooling efficiency.

Folding lines in a single air baffle adapt to varying component layouts, eliminating the need for multiple specialized designs and reducing assembly complexity.

Ventilation plate with internal seal calibrates airflow, reducing manual errors and ensuring consistent cooling.

Dual fan modules feed distinct paths into a mixing chamber, ensuring uniform temperature across vertically arranged routers.

A composite spring heat spreader transfers thermal energy from electronic components to cooling structures using elastic deformation.

Cooling back pan assembly uses fan-driven air flow through a rear gap to manage thermal loads in electronic displays.

A cooling system with a blind mate connector links a pump cassette to electrical components for efficient thermal management.

Overlapping orthogonal fins create three-dimensional swirling coolant flow, increasing thermal conductivity while reducing pumping pressure drop.

A modular cooling device supplies precise cooling medium volumes to heat-generating components via customizable tube networks.

A wicking film element couples to electronic components and draws dielectric fluid via capillary action for evaporative cooling.

A modular cooling infrastructure combines dry coolers and liquid heat exchangers to manage IT equipment temperatures.

Passive thermodynamic systems eliminate forced-air energy costs and airborne impurities through phase change and earth absorption.

Blind mating connectors deploy side fluid cooling modules to resolve high-power density thermal management challenges in server racks.

Internal air distribution ramps channel pressurized airflow to enhance natural convection cooling in electronic racks.

Rotating the handle reorients the fan tray to reverse airflow direction, eliminating the need for separate assemblies in dual-direction systems.

Locking section prevents rotation of operative section in cooling recess, maintaining stable heat transfer for power semiconductors.

A one-piece chassis mounts transformers, rectifiers, and control circuitry within a welding power supply housing.

Integrates heat exchangers and pump units within the existing rack footprint to manage thermal loads without requiring additional floor space.

Elliptical vent openings form uninterrupted load paths to enhance shear load capacity in electronic housings.

Additive manufactured modules with opposing fluid paths reduce thermal resistance, resolving complex machining bottlenecks in railway power module cooling.

Regulated bypass lines stabilize cooling liquid pressure to prevent uneven flow and device damage in submerged server arrays.