Vented Sub-Rack Support for PXI Cooling
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Solution Overview
Problem
The compact design of PXI modules makes it difficult to cool heat-producing components effectively, leading to elevated ambient temperatures and potential component failures due to ineffective air flow patterns.
Innovation Solution
A vented and ducted sub-rack support member is introduced to redirect and increase air flow velocity over heat-producing components, using vents and deflectors to optimize air flow distribution and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If compact PXI module design is used, then space utilization is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a third dimension for air flow by creating vertical channels through the support member that direct cooling air from below toward components on the backplane. This vertical air flow dimension complements the horizontal fan-driven flow, enabling effective cooling in the compact module design without increasing footprint area.
Solution Approach 2:
The support member is segmented with multiple discrete air flow channels and vents positioned at specific locations. Each channel serves a particular cooling zone, allowing targeted heat dissipation to different component areas. This segmentation enables optimized cooling paths within the limited space of the compact module.
2Productivity
If air flow is increased to improve cooling, then heat dissipation is improved, but air flow uniformity deteriorates
Solution Approach 1:
The support member features locally optimized air flow channels with varying geometries positioned at different locations. Channels near high-heat components have different dimensions and orientations compared to other areas, delivering higher air flow velocity where needed most while maintaining overall system balance. This local quality approach ensures uniform effective cooling across all components despite varying heat generation patterns.
Solution Approach 2:
The support member acts as an intermediary structure that mediates between the fan-generated air flow and the components requiring cooling. It incorporates deflectors and channel structures that redistribute and smooth the air flow, transforming the non-uniform fan output into more uniform localized cooling streams at component surfaces.
3Temperature
If additional cooling structures are added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The support member is designed as a multi-functional component that simultaneously provides mechanical support for the backplane and integrated cooling functions. The same structural element incorporates air flow channels, vents, and deflectors, eliminating the need for separate cooling devices. This universality reduces overall device complexity while maintaining effective heat dissipation capability.
Solution Approach 2:
The cooling structures are merged directly into the support member fabric rather than being added as separate attachments. Air flow channels are formed within the support member material itself, and cooling functions are combined with the load-bearing structure, reducing the total number of discrete parts and simplifying assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation and reduces ambient temperatures around components, improving cooling efficiency and extending component lifespan by ensuring uniform air flow and targeted cooling.
Implementation Method 1
A portion of the air flow within the chassis is diverted through the vented and ducted sub-rack support member to provide cooling to heat producing electronic or electrical components
Implementation Method 2
A scoop portion of the vented and ducted sub-rack support member forms a channel (also referred to herein as a duct) beneath the vented and ducted sub-rack support member that may direct air flow through the air flow vents
Implementation Method 3
An angled scoop portion may compensate for this variation so that the velocity of the air flowing through the vents may be approximately uniform along the length of the vented and ducted sub-rack support member
Implementation Method 4
The increased air flow may increase air flow velocity and decrease the ambient temperature of the air around the components and improve the dissipation of heat from the components into the air
Data Source
AI summary
A chassis for plug-in modules may be provided with a vented and ducted sub-rack support member. The vented and ducted sub-rack support member may deflect a portion of the air flowing within the chassis through vents in the top surface of the vented and ducted sub-rack support member in order to increase the air flow to heat producing components mounted on the backplane above the support member. The increased air flow may increase air flow velocity and decrease the ambient temperature of the air around these components and improve the dissipation of heat from each component into the air. Air flow above the vented and ducted sub-rack support member may also be redirected by upper deflectors mounted on the support member to portions of plug-in cards adjacent to the upper deflectors and may provide additional cooling to components on the plug-in cards near the backplane.