Passive Heat Transferring System for Set Top Box Thermal Management
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Solution Overview
Problem
Conventional set top boxes face challenges in effectively transferring heat away from integrated circuit chips while maintaining a low profile, as they require active cooling systems that occupy significant spatial envelope for fan or blower operation.
Innovation Solution
A thermally conductive chassis with a thermal interface material and a heat transferring unit, combined with a gap filler material, facilitates efficient heat transfer from the chip to the chassis, minimizing radiant heat build-up and eliminating the need for active cooling mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling systems (fans or blowers) are used to transfer heat away from the chip, then heat transfer effectiveness is improved, but the spatial envelope required within the STB increases
Solution Approach 1:
The invention extracts the active cooling mechanism (fan or blower) from the system and replaces it with a passive heat transfer system. The heat transfer is achieved through thermally conductive materials and structural design that conduct heat away from the chip to the chassis and ultimately to the ambient environment without requiring moving parts or active components.
Solution Approach 2:
The invention introduces thermal interface materials and thermally conductive chassis as intermediary elements between the heat-generating chip and the ambient environment. These intermediaries facilitate heat transfer through conduction, eliminating the need for active convection or forced air movement. The chassis itself acts as a heat sink and thermal pathway.
2Length of moving object
If the STB is designed with a low profile to reduce spatial constraints, then aesthetics and portability are improved, but heat transfer capability deteriorates
Solution Approach 1:
The invention applies local quality by using thermally conductive chassis materials specifically in the heat transfer pathway from the chip. The chassis is designed with varying thermal conductivity properties in different regions, with higher conductivity near the chip and progressive heat dissipation toward the exterior surfaces. This localized thermal management enables effective heat transfer within a compressed vertical profile.
Solution Approach 2:
The invention transitions heat transfer from a primarily vertical pathway (requiring height for fan operation) to a multi-dimensional conduction pathway through the chassis. Heat is conducted laterally and vertically through thermally conductive chassis structures, utilizing the chassis surface area and three-dimensional thermal pathways to dissipate heat without requiring significant vertical space for active cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a low-profile media content receiving device that efficiently transfers heat to the ambient environment, reducing the device's spatial requirements and potentially extending its operational life without the need for fans or blowers.
Implementation Method 1
A thermal interface material is disposed between the integrated circuit chip and the thermally conductive chassis, wherein a first side of the thermal interface material is in thermally conductive contact with the at least one integrated circuit chip
Implementation Method 2
A thermally conductive heat transferring unit is disposed between the thermal interface material and the thermally conductive chassis, a first side of the thermally conducted heat transferring unit is in thermally conductive contact within an opposing side of the thermal interface material
Implementation Method 3
the gap filler material being in thermally conductive contact with the second side of the thermal interface material
Implementation Method 4
The thermally conductive heat transferring unit is arranged to transfer heat from the at least one integrated circuit chip to the at least one panel of the chassis while minimizing radiant heat build-up proximate the at least one integrated circuit chip
Data Source
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AI summary
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.