Electro-osmotic Pump Cooling System with Thermal Fittings
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Solution Overview
Problem
Current cooling systems for electronic devices are inadequate in efficiently dissipating heat generated by high-density components, necessitating the development of more effective heat management solutions.
Innovation Solution
A method involving a core with channels, a cover thermally coupled to the core, an electro-osmotic pump, gas collectors, and a heat exchanger, with leak-proof joints created using thermal fittings to form a fluid circuit that facilitates efficient heat transfer and gas management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used for high-density electronic components, then the system structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The cooling system is divided into multiple independent modules including electro-osmotic pump modules, heat exchanger modules, and gas collection chambers. Each module performs a specific function and can be independently manufactured and assembled, enabling efficient heat dissipation through distributed cooling channels while maintaining modular simplicity
Solution Approach 2:
The cooling channels are integrated within the core structure itself, with the core serving as both the structural support and the heat dissipation pathway. The channels are nested within the core material, allowing heat to be conducted through the core walls directly to the coolant flowing in the channels, thereby improving heat dissipation efficiency without adding external complexity
2Reliability
If thermal fittings are used to create leak-proof joints, then the sealing reliability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
Thermal fittings are used to create leak-proof joints between components. The fitting process involves heating the joint components to cause thermal expansion, allowing for easier assembly, and then cooling to create a tight interference fit that ensures leak-proof sealing. This approach achieves high sealing reliability while accommodating normal manufacturing tolerances through the thermal expansion mechanism
3Reliability
If electro-osmotic pumps are used for coolant circulation, then the gas management is improved, but the device complexity increases
Solution Approach 1:
The electro-osmotic pump utilizes the natural electro-osmotic effect where an electric field applied across a porous medium or membrane causes fluid to move through it. The pump structure includes electrodes and a porous membrane that automatically generate the pumping action when voltage is applied, eliminating the need for complex mechanical moving parts, valves, or external actuation mechanisms. Gas collection chambers are integrated to automatically capture and remove gas bubbles that form during operation, maintaining system reliability without adding significant complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation by utilizing an electro-osmotic pump and heat exchanger, reducing cavitation and electrode erosion, and ensuring a leak-proof seal, thereby enhancing the cooling efficiency of electronic devices.
Implementation Method 1
providing an electro-osmotic (EO) pump configured to couple operationally to the at least one gas collection chamber; coupling the EO pump to the at least one gas collection chamber
Implementation Method 2
providing at least one leak proof joint, said leak proof joint being a thermally sealed joint between any of the core, cover, EO pump, and/or the at least one gas collection chamber
Implementation Method 3
providing a heat exchanger and operationally coupling the heat exchanger to the EO pump
Data Source
AI summary
Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open channels on a surface of the core; coupling a cover to the core to cover the open channels; and coupling the cover to the core with a thermal fitting. In some embodiments, an electro-osmotic (EO) pump, a heat exchanger, and one or more gas accumulators are coupled to the core via a fluid circuit. In certain embodiments, a first gas accumulator is coupled to the EO pump with a thermal fitting, the EO pump is coupled to the heat exchanger with a thermal fitting, and the heat exchange is coupled to a second gas accumulator with a thermal fitting. In one embodiment, the first gas accumulator and the second gas accumulator are coupled to the core with thermal fittings.