Cover Plate Cooling Channel Reduces Heat Transfer Fluid in Server Enclosures
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Solution Overview
Problem
Conventional cooling systems for servers require large amounts of heat dissipation liquid, which can lead to leakage and increased operational costs, as the heat exchange process necessitates conveying the liquid outside the server enclosure.
Innovation Solution
A cooling system comprising a container with a heat transfer fluid, a heat dissipation module, and a cooling module that includes a cover plate with a cooling channel and a heat dissipation fin assembly, where the heat transfer fluid exchanges heat within the container, reducing the need for external conveyance and minimizing fluid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation liquid is circulated outside the server box body for heat exchange, then heat dissipation effectiveness is improved, but the amount of liquid required increases and leakage risk increases
Solution Approach 1:
The cooling channel is nested within the cover plate structure, and the heat dissipation fin assembly is nested within the container. This nested configuration allows heat exchange to occur within the server enclosure rather than requiring external circulation, reducing the total amount of heat dissipation liquid needed while maintaining effective heat dissipation.
2Temperature
If heat dissipation liquid is circulated outside the server box body, then heat exchange capability is improved, but leakage risk during entering and exiting increases
Solution Approach 1:
The cooling channel is merged with the cover plate to form an integrated structure, and the heat dissipation fin assembly is merged with the container. This integration eliminates the need for separate fluid conduits that would require entering and exiting the box body, thereby reducing leakage risk while maintaining heat exchange capability through internal heat transfer pathways.
3Temperature
If large amount of heat dissipation liquid is used for heat exchange, then cooling performance is improved, but operational costs increase
Solution Approach 1:
The system uses the server's own cover plate and container structures to serve as heat exchange components. The cooling channel within the cover plate and the heat dissipation fin assembly within the container work together to provide self-contained cooling, reducing the need for large volumes of external heat dissipation liquid and thereby lowering operational costs associated with liquid consumption and maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the amount of heat transfer fluid required, minimizing leakage and evaporation losses, and lowers operational costs by allowing heat exchange within the container, thereby enhancing thermal management efficiency.
Implementation Method 1
heat energy generated by heating components on the main boards is absorbed by the heat dissipation liquid, and is circulated to outsides of box bodies of the servers through the heat dissipation liquid, to exchange heat with water or air
Implementation Method 2
the cover plate includes a cooling channel, the cooling channel are arranged in the cover plate, the cooling channel includes an inlet and an outlet
Implementation Method 3
an other side of the heat dissipation fin assembly is located in the container
Data Source
AI summary
A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.