Liquid Cooling Loop With Multiple Pumps For Uniform Flow
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Solution Overview
Problem
Existing liquid cooling loop systems for electronic heat-generating apparatuses face challenges with coolant flow uniformity and delivery power due to the use of a single pump in series, which becomes inadequate with increasing server components.
Innovation Solution
A liquid cooling loop heat dissipating device with multiple pumps installed in a limited space, featuring a power distribution assembly with two convergence delivery assemblies and a serial pipeline connected between cooling reservoirs and heads, ensuring uniform coolant flow and delivery power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single pump is used to deliver coolant in series through multiple cooling heads, then the device complexity is reduced, but the coolant flow uniformity deteriorates and delivery power is insufficient
Solution Approach 1:
The patent divides the single pump system into multiple independent pumps (first pump and second pump), with each pump responsible for delivering coolant to specific cooling heads. This segmentation allows each pump to independently control coolant flow to its designated cooling heads, ensuring uniform coolant flow distribution and sufficient delivery power across all cooling heads without increasing overall system complexity.
2Power
If multiple pumps are added to increase coolant delivery power, then the propulsion of coolant flow is improved, but the device complexity increases and space requirement expands
Solution Approach 1:
The patent combines multiple pumps and cooling heads into an integrated modular structure where the first pump, second pump, and multiple cooling heads are arranged in a compact configuration. The pumps are positioned to share common piping infrastructure, and the cooling heads are grouped to efficiently utilize the coolant flow from each pump. This merging approach increases coolant delivery power while maintaining manageable device complexity through systematic integration.
3Reliability
If multiple pumps are installed to achieve uniform coolant flow, then the delivery power is improved, but the installation space requirement increases
Solution Approach 1:
The patent employs a nested arrangement where the first pump and second pump are positioned within or adjacent to each other, and the cooling heads are arranged in a compact series configuration. The piping system is routed to nest efficiently around the pump assemblies, with the first cooling head and second cooling head positioned to share common coolant pathways. This nested doll approach enables uniform coolant flow distribution through multiple pumps while minimizing the overall installation footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages coolant flow and delivery power, ensuring uniform cooling and heat dissipation across multiple components by utilizing multiple pumps and a structured pipeline arrangement, enhancing the efficiency of the liquid cooling loop system.
Implementation Method 1
multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head separately corresponding to each of the cooling pumps
Implementation Method 2
after the cooling head absorbs the heat from the heat source
Data Source
AI summary
A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.