Back-to-Back Display Module with Rear-Mounted IC for Thin Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to achieve downsizing and a thin shape for electronic devices like cellular phones, which require increased functionality and multiple screens, while managing the antinomy between higher added value and the need for a compact, lightweight design.
Innovation Solution
A display module is designed with a first display panel and a smaller second display panel, arranged back to back, where the second panel is overlapped with the first, and an integrated circuit controls both panels, eliminating the need for a conventional printed board, allowing for compact and thin design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of components and IC chips is increased to achieve higher functionality, then the device functionality is improved, but the device size and weight increase
Solution Approach 1:
The patent combines multiple functional components (display panel, touch panel, circuit board, camera, battery) into a single integrated display module structure. The circuit board is mounted on the rear surface of the display panel, merging what would traditionally be separate assemblies into one compact unit, thereby reducing overall device weight while maintaining full functionality.
Solution Approach 2:
The patent implements a nested arrangement where the touch panel is positioned in front of the display panel, the circuit board is mounted on the rear surface of the display panel, and the camera and battery are integrated within the same housing space. This nesting approach allows multiple components to occupy overlapping or adjacent spaces, reducing the overall device footprint and weight.
2Adaptability or versatility
If multiple IC chips and components are mounted on a printed board, then the device functionality is improved, but the printed board area and device thickness increase
Solution Approach 1:
The patent transitions from a planar arrangement of components on a printed board to a three-dimensional configuration where the circuit board is mounted vertically on the rear surface of the display panel. This dimensional change allows components to be arranged in space rather than confined to a two-dimensional plane, reducing the required printed board area while accommodating multiple IC chips and components.
3Adaptability or versatility
If a conventional printed board structure is used to mount components, then the device functionality is improved, but the device thickness increases
Solution Approach 1:
The patent employs a flexible circuit board that can be mounted on the rear surface of the display panel, replacing rigid printed boards. This flexible film structure reduces the overall device thickness while providing the necessary electrical connections and component mounting capabilities, allowing the device to achieve a thinner profile without sacrificing functionality.
Data Source
AI summary
It is an object to achieve downsizing and a thin shape of a display module and an electronic device provided with the display module. The display module includes a first display panel in which a first display screen is formed on one main side; and a second display panel that is smaller than and overlapped with the first display panel, in which a second display screen is formed on an opposite side of the one main side. The display module includes, over a sealing substrate of the first display panel and/or the second display panel, at least one integrated circuit, which is connected to input terminals of the first display panel and the second display panel and controls operation of the both panels, arranged in a peripheral portion of the second display panel, which is a surface on an opposite side of a display surface of the first display panel.