Back-to-Back Isolation Circuit Monolithic Substrate

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Solution Overview

Problem

Existing galvanic isolators struggle to provide sufficient electrical isolation between circuits operating at different voltages or with different ground potentials, especially in high-voltage applications, and require multiple components connected in series, which increases footprint and costs.

Innovation Solution

A back-to-back isolator configuration on a single monolithic substrate, where multiple isolators are connected in series, utilizing discrete dielectric regions for enhanced electrical isolation and reduced bond connections, allowing for higher isolation voltages and cost savings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple isolators are connected in series on separate substrates to achieve higher isolation voltage, then the isolation voltage increases, but the device footprint and complexity increase

Engineering Contradiction:

Improveisolation voltageVSAvoiddevice footprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

Multiple isolators are merged onto a single monolithic substrate to form an integrated back-to-back isolator device. This consolidation achieves the same cumulative isolation voltage as separate substrates while reducing the overall device footprint and eliminating the need for multiple discrete components and interconnections.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The isolators are arranged in a vertical stacked configuration on the substrate, utilizing the third dimension (height/layering) rather than spreading components horizontally. This vertical integration maintains electrical isolation between components while significantly reducing the planar footprint of the device.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple isolators are connected in series on separate substrates to achieve higher isolation voltage, then the isolation voltage increases, but the device complexity and cost increase

Engineering Contradiction:

Improveisolation voltageVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If discrete dielectric regions are positioned between isolator components to provide electrical isolation, then the electrical isolation improves, but the manufacturing complexity increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The discrete dielectric regions serve multiple functions simultaneously: they provide electrical isolation between adjacent isolator components, serve as structural support elements, and act as spacing maintainers that define the precise positioning of components. This multi-functionality reduces the need for additional dedicated isolation structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves higher isolation voltages with reduced footprint and costs, enabling effective isolation in high-voltage applications such as industrial and medical settings, while simplifying design and reducing the number of necessary connections.

Implementation Method 1

The first isolator component is positioned to electromagnetically couple with the second isolator component

Methodology Applied

Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 2

The third isolator component is positioned to electromagnetically couple with the fourth isolator component

Methodology Applied

Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 3

The first dielectric region is positioned between the first isolator component and the second isolator component, and a second dielectric region is positioned between the third isolator component and the fourth isolator component

Methodology Applied

Scientific EffectDielectric isolation: Dielectric

Data Source

PatentUS11044022B2Back-to-back isolation circuit

Publication Date: 2021.06.22 ANALOG DEVICES GLOBAL UNLTD

AI summary

Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.