Backlight Assembly Heat Dissipation Channel Design

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Solution Overview

Problem

Backlight assemblies face heat dissipation challenges due to increased luminance, leading to deteriorated display quality and potential damage to the light emitting module, especially in edge-illumination types where heat is concentrated, necessitating effective heat dissipation methods without compromising material thickness or weight.

Innovation Solution

A backlight assembly design featuring a receiving container with a heat dissipation channel formed by combining first and second frames, utilizing a refrigerant and channel layer to enhance thermal conductivity, and optionally incorporating graphite or sintered metal particles to improve heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the number of LEDs is increased to enhance luminance, then the luminance of the backlight assembly is improved, but heat generation increases causing display element deterioration and light emitting module damage

Engineering Contradiction:

ImproveluminanceVSAvoidheat generation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The receiving container is divided into multiple receiving spaces by partition walls, with each space containing a corresponding heat dissipation channel. This segmentation allows heat to be dissipated from multiple localized areas simultaneously, improving overall heat dissipation efficiency while supporting high LED density for enhanced luminance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation channels are introduced as intermediary structures between the LED modules and the external environment. These channels serve as thermal pathways that conduct heat away from the LED components, enabling high luminance operation while controlling temperature rise.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation means is added to dissipate heat from the light emitting module, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation channels are integrated directly into the receiving container structure itself, merging the heat dissipation function with the existing structural framework. This eliminates the need for separate heat dissipation components, reducing overall device complexity while maintaining effective heat management.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The receiving container serves multiple functions: it holds the light emitting module, provides structural support, and acts as a heat dissipation system through its integrated channels. This multi-functionality reduces the need for additional dedicated heat dissipation components, simplifying the overall device structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If the receiving container uses high thermal conductivity material with thin thickness, then heat dissipation characteristic is enhanced, but material selection is limited due to weight and thickness constraints

Engineering Contradiction:

Improveheat dissipation characteristicVSAvoidmaterial selection flexibility

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

Instead of relying solely on increasing thermal conductivity in the thickness direction, the design extends heat dissipation channels horizontally within the receiving container plane. This dimensional approach allows effective heat dissipation without requiring thick or high-conductivity materials, maintaining material selection flexibility while meeting thermal performance requirements.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation capabilities, reducing the overall thickness of the display apparatus and increasing thermal conductivity, effectively managing heat without additional dissipating means, thereby improving display quality and extending module lifespan.

Implementation Method 1

The channel layer may move the refrigerant using a capillary pressure

Methodology Applied

Scientific EffectCapillary pressure: Capillary Pressure

Implementation Method 2

Heat dissipation characteristic may be the more enhanced as thermal conductivity of material forming the receiving container is increased

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8845139B2Backlight assembly

Publication Date: 2014.09.30 SAMSUNG DISPLAY CO LTD

AI summary

A backlight assembly includes a light emitting module and a receiving container. The receiving container receives the light emitting module, and includes a first frame, a second frame and a heat dissipation channel. The first frame includes a first bottom, and first sidewalls connected to the first bottom. The second frame includes a second bottom which faces the first bottom and is sealed with the first frame. The first and second bottoms are spaced apart from each other and form the heat dissipation channel therebetween.