Lighting Heating/Cooling Arrangements TRIZ Cases

A light emitting diode active layer uses multiple quantum well layers with varying indium ratios to capture charge carriers and reduce energy levels.

Radial cooling medium circulation removes heat from the LED cavity, eliminating installation direction limitations and ensuring reliable operation.

A backlight module integrates a light guide plate, printed circuit board, and heat-dissipating bracket into a unified assembly.

A thermally conductive porous body impregnated with bonding material creates a three-dimensional heat-conducting path within the wavelength conversion member.

A light projection device uses a tapered slit to enable multi-directional imaging while maintaining illumination intensity.

A vehicle lamp uses stepped outer and inner lenses to refract light into distinct circular and ring-shaped emitting areas.

Monolithic bodies integrate support and optics within a shaped housing, reducing tooling costs for customized retail lighting designs.

An LED module balances internal pressure via air vents while an insulating heat radiation coating layer improves thermal dissipation.

An asymmetric sealed body with thermally conductive liquid enables passive convective flow for efficient heat dissipation regardless of bulb orientation.

A reflective mirror module with an adjusting mechanism aligns mirrors to the optical axis, reducing power loss and overheating from assembly errors.

A semiconductor light emitting device uses a wavelength conversion material in the support to transform emitted light.

A wavelength conversion element uses a protective layer and porous phosphor to prevent metal ion deposits while cooling light sources.

Metallized heat extraction ducts in rear automotive lights boost flue effect and air flow speed to cool LEDs without forced-air systems.

Pin-fin arrays on the base manage LED heat while maintaining uniform omnidirectional illumination across a wide latitude range.

A UV light assembly directs radiation toward the interior surface of a coolant-cooled heat sink to inhibit bacterial growth.

Separating the substrate from the heat sink eliminates costly die-casting and secondary machining while maintaining effective heat dissipation.

An Eu3+-doped ceramic converter absorbs 465 nm laser light to emit red photoluminescence, improving luminance and color rendering index.

A circular metal core board supports an LED and annular driver circuit to dissipate heat through the host fixture.

Directed airflow cools the lamp base, reducing oxidation and corrosion that shorten lamp lifetime.

A graphene and metal oxide stack provides electrical conduction for UV light emission.

Thermally conductive translucent elements redirect and recycle light while conducting heat away from LEDs, eliminating bulky appended heat sinks.

Segmented receiving containers with integrated refrigerant channels dissipate LED heat, reducing display thickness while preventing module damage.