Wavelength Conversion Device Separate Substrate Heat Sink
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Solution Overview
Problem
The integration of substrate and cooling fins in existing wavelength conversion devices necessitates costly die-casting and secondary machining for achieving necessary surface roughness and flatness, leading to increased manufacturing costs.
Innovation Solution
A wavelength conversion device with a separate substrate and heat sink configuration, allowing for efficient heat transfer and assembly, and the use of a low heat resistance member to reduce thermal resistance, along with a balance adjustment member to prevent wobble during rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate and cooling fins are integrally formed using die-cast, then heat dissipation is improved, but manufacturing costs increase due to necessary secondary machining for surface roughness and flatness
Solution Approach 1:
The patent divides the previously integrated substrate and cooling fins into separate components. The substrate and cooling fins are manufactured independently and then assembled together, eliminating the need for costly die-casting and secondary machining operations while maintaining effective heat dissipation functionality.
2Stability of the object's composition
If the substrate and cooling fins are integrally formed, then structural stability is improved, but manufacturing complexity increases due to required die-casting and secondary machining processes
Solution Approach 1:
The patent segments the integrated structure into separate substrate and cooling fin components that are assembled together. This simplification of the manufacturing approach reduces process complexity while the design ensures structural stability is maintained through proper assembly configuration.
Solution Approach 2:
The patent combines the separately manufactured substrate and cooling fins into a functional assembly. This merging of independent components achieves the same structural stability as an integrated design but with simplified manufacturing processes.
3Ease of manufacture
If separate substrate and heat sink configuration is used, then manufacturing costs are reduced, but heat transfer efficiency may be affected
Solution Approach 1:
The patent introduces a low heat resistance member as an intermediary between the substrate and heat sink. This mediator component ensures efficient heat transfer between the separately configured substrate and heat sink, eliminating potential thermal resistance issues while maintaining the cost advantages of separate manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs, enhances heat management, and maintains image quality while providing bright and cost-effective illumination for projectors.
Implementation Method 1
a low heat resistance member that decreases heat resistance between the substrate and the heat sink may be provided between the substrate and the heat sink
Implementation Method 2
The plurality of fins can efficiently radiate heat of the flat plate
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A wavelength conversion device includes a substrate having a first surface and a second surface, a wavelength conversion element provided on the first surface, and a heat sink provided on the second surface separately from the substrate.