Backlight Module Cooling With Electrowetting Droplet Heat Control
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Solution Overview
Problem
Mini LED displays face challenges with passive heat dissipation methods that fail to quickly and efficiently cool down localized high heat generated by mini LEDs, leading to potential color shifts and reduced lifespan due to uneven heat distribution.
Innovation Solution
A backlight module with a heat dissipation structure featuring a first and second control layer, where coolant droplets are moved under light-emitting elements to absorb heat and then removed when the heat condition changes, utilizing a driver chip to control the movement of coolant droplets through hydrophilic and hydrophobic state changes, ensuring efficient heat dissipation and temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive heat dissipation methods (cooling fan, cooling holes, heat dissipation structure) are used, then the structure is simple and easy to manufacture, but they cannot quickly discharge high-density heat generated by local LED positions in a short period of time
Solution Approach 1:
The patent employs dynamic droplet displacement to enable the heat dissipation structure to actively respond to heat generation. Coolant droplets are dynamically positioned under LED chips that generate excessive heat through electric field control, allowing the system to adaptively move heat dissipation resources to where they are most needed, thereby achieving rapid local heat discharge while maintaining a relatively simple overall structure.
Solution Approach 2:
The patent changes the physical state parameters of the coolant by controlling its phase transition between liquid and vapor states through electric field application. By adjusting the temperature and electric field parameters, the coolant can rapidly absorb heat through evaporation and then condense back to liquid form, enabling quick heat dissipation cycles that significantly improve heat discharge efficiency without requiring complex mechanical cooling systems.
2Device complexity
If fixed structure heat dissipation methods are used, then the device complexity is low, but they are unable to quickly cool down in a localized and targeted manner the mini LED display having an uneven heat generation structure
Solution Approach 1:
The patent applies local quality by directing heat dissipation resources specifically to the LED chips that generate excessive heat. Through electric field control, coolant droplets are selectively positioned only under the hot spots rather than uniformly distributing cooling across the entire display. This localized approach enables targeted heat dissipation that adapts to uneven heat generation patterns while keeping the overall device structure relatively simple.
Solution Approach 2:
The patent implements a feedback mechanism where temperature sensors detect heat generation at different LED positions and this information is used to control the displacement of coolant droplets. The system continuously monitors temperature distribution and dynamically adjusts droplet positioning based on real-time thermal conditions, enabling the heat dissipation structure to adapt to uneven heat generation patterns and providing rapid localized cooling where needed.
3Illumination intensity
If more partitions are designed in mini LED display, then the brightness and resolution are improved, but the heat generation becomes more concentrated and localized, causing color shift and requiring more complex heat dissipation solutions
Solution Approach 1:
The patent segments the heat dissipation function by using individual controllable coolant droplets for different LED partitions. Each droplet can be independently positioned and controlled to cool specific high-brightness partitions that generate concentrated heat. This segmented approach allows the system to maintain high brightness and resolution across multiple partitions while providing targeted heat dissipation for each partition, preventing color shift without requiring a uniformly complex cooling system across the entire display.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from mini LEDs, preventing local overheating and extending the service life of mini LEDs by maintaining temperature uniformity and rapidly cooling down localized heat in a short period.
Implementation Method 1
When a voltage difference is formed between each of the second control electrodes and the first control electrode layer, the positions of the first hydrophobic layer and the second hydrophobic layer corresponding to the second control electrodes are both hydrophilic, and when a zero voltage is formed between each of the second control electrodes and the first control electrode layer If not, both the first hydrophobic layer and the second hydrophobic layer are hydrophobic at positions corresponding to the second control electrode
Implementation Method 2
there is disposed a coolant droplet in the gap. When a light-emitting element satisfies a first heating condition, the first control layer and the second control layer control the coolant droplet to move to a position underneath the light-emitting element
Data Source
AI summary
A backlight module and a display device are disclosed. The backlight module includes a light board and a heat dissipation structure. Multiple light-emitting elements are arranged in a matrix on the light board. The heat dissipation structure includes a first control layer arranged on a side of the light board facing away from the light-emitting elements, and a second control layer opposite to the first control layer. There is a gap between the first control layer and second control layer, and there is disposed a coolant droplet in the gap. When a light-emitting element satisfies a first heating condition, the first control layer and second control layer control a coolant droplet to move to a position underneath the light-emitting element. When the light-emitting element satisfies a second heating condition, the first control layer and second control layer control the coolant droplet to leave the position underneath the light-emitting element.