Backlight Module Mixed Coating Heat Dissipation
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Solution Overview
Problem
Current backlight modules face inefficiencies in heat dissipation due to high thermal resistance between LED light strips and aluminum extrusions, primarily caused by the low thermal conductivity of thermal pads, leading to elevated temperatures and reduced lifespan.
Innovation Solution
A mixed coating layer comprising two materials with distinct temperature-dependent molecular vibration frequencies, combined with a thermal diode/triode, is used to enhance heat transfer by regulating temperature and aligning vibration frequencies, eliminating the need for thermal pads and allowing unobstructed heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal pad is added between the LED light strip and the aluminum extrusion to fill the air gap, then the contact thermal resistance is reduced, but the thermal conductivity of the thermal pad is low and it becomes a bottleneck in the heat conduction path
Solution Approach 1:
The patent applies composite materials by combining two different materials in the coating layer: a first material with high thermal conductivity (such as aluminum oxide or boron nitride) and a second material with low thermal conductivity (such as silicone rubber or polyimide). This composite structure allows the coating to simultaneously achieve good thermal conduction through the high-conductivity material while maintaining flexibility and filling gaps through the low-conductivity material, thereby resolving the contradiction between heat dissipation performance and temperature control.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the coating layer by selecting specific material combinations and controlling their proportions. By adjusting the ratio of high-conductivity to low-conductivity materials, the coating's thermal conductivity can be optimized to match the thermal requirements of the interface between the LED light strip and aluminum extrusion, achieving effective heat dissipation without creating a thermal bottleneck.
2Reliability
If a thermal pad with substantial thickness is used to fill the air gap, then the contact thermal resistance is reduced, but the side frame of the module cannot be made narrow
Solution Approach 1:
The patent uses a thin film coating layer applied directly on the surface of the aluminum extrusion, eliminating the need for thick thermal pads. The coating layer, being a thin film, provides sufficient thermal conduction to fill the contact gap while occupying minimal space, thereby enabling the side frame to be made narrow without compromising heat dissipation performance.
Solution Approach 2:
The patent extracts and eliminates the thermal pad component from the traditional assembly. Instead of using a separate thermal pad with substantial thickness, the invention integrates thermal conduction functionality directly into the coating layer applied on the aluminum extrusion surface, thereby removing the space-consuming thermal pad while maintaining heat dissipation effectiveness.
3Device complexity
If the LED light strip is attached directly to the aluminum extrusion without any intermediate material, then the structure is simplified, but the contact gap creates great thermal resistance
Solution Approach 1:
The patent introduces a coating layer as an intermediary material between the LED light strip and the aluminum extrusion. This coating layer serves as a mediator that fills the contact gap and provides thermal conduction, enabling effective heat dissipation while maintaining a relatively simple structure. The coating layer acts as the intermediate substance that resolves the thermal resistance issue without requiring complex multi-component assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation, reducing LED light strip temperatures, extending its lifespan, and allowing for a narrower module design by eliminating thermal pads and enhancing thermal conductivity.
Implementation Method 1
The mixed coating layer is interposed between the LED light strip and the aluminum extrusion and contacts both for transfer of heat
Implementation Method 2
The thermal diode/triode is connected to the mixed coating layer to control temperature of the mixed coating layer
Implementation Method 3
One of the two materials has a molecular vibration frequency that varies, not proportionally, with variation of temperature and the other material has a vibration frequency that varies proportionally with variation of temperature
Data Source
AI summary
The present invention relates to a backlight module that enhances heat dissipation of LED light sources and a display device. The backlight module that enhances heat dissipation of LED light sources includes an LED light strip, a back panel, a mixed coating layer including two materials, and a thermal diode/triode. The LED light strip is arranged on the back panel. The mixed coating layer is interposed between the LED light strip and the back panel and contacts both for transfer of heat. The thermal diode/triode is connected to the mixed coating layer to control temperature of the mixed coating layer. In operation, through regulation of temperature, the thermal diode/triode makes vibration frequencies of the two materials of the mixed coating layer consistent with each other at a given temperature. The display device includes the above descried backlight module that enhances heat dissipation of LED light sources. The present invention realizes obstruction free transfer of heat from the LED light strip to the aluminum extrusion or the back panel, eliminating bottleneck of heat conduction path; reduces the temperature of the LED light strip, extending the overall lifespan of the LED light strip; and eliminates the use of thermal pad in the backlight module so as to facilitate designing narrow side frame of the backlight module.