Lighting Heating/Cooling Arrangements TRIZ Cases

Thermally conductive ribs distribute heat across the display surface, preventing hot spots and maintaining optical consistency in high-brightness environments.

Segmenting lower-powered emitters into an addressable array maintains coherence and polarization while reducing energy consumption.

Segmented circulation units isolate phosphor heat from red lasers, maintaining brightness.

A lighting apparatus merges a transparent dome reflector and aluminum light engine housing into one component.

Chamfered surfaces on LED heat dissipation casings create non-coplanar air inlet holes that separate intake from exhaust paths.

A light-emitting device holder uses an elastic silicone resin insulating member to contact the substrate between pads and edges.

A backlight module light refracting layer uses dual refractive indices to adjust light distribution and reduce halo occurrence in Mini LED displays.

A custom shell mounts auxiliary lights to a vehicle sideview mirror without drilling.

A lamp holder assembly uses a lens and sloped heat radiator platform to direct light emission directly through the optical component.

Asymmetric optical axis redirects backscatter radiation away from the dispenser, preventing premature material curing and maintaining system reliability.

Optimized nozzle positioning directs cooling gas via the Coanda effect to prevent excessive lamp tube cooling and lighting failures.

A color wheel design uses a metal piece to conduct heat from the phosphor wheel.

Micrometer scale pores stabilize during sintering to boost productivity while reducing speckle noise in optical devices.

A heat radiator positioned between the OLED panel and driving circuit board redirects thermal energy away from sensitive display components.

A cylindrical underwater light uses a thermally conductive housing and internal water cooling to dissipate heat from angled LEDs.

A display device diffusing lens uses separate engaging and positioning portions to secure the optical component on a substrate.

A condensed metal phosphate matrix embeds phosphors to enable efficient radiation conversion while dissipating heat from high-power excitation sources.

An LED module replaces air with a refractive index-matched encapsulant between the lens group and heat sink, improving light out-coupling efficiency by 10-15%.

Mixed coating layers with thermal diodes align material vibration frequencies to eliminate thermal pad bottlenecks and narrow side frames.

Branching catches on the housing secure a direct reflector and lens via snap-fit joints, eliminating precise hole patterns.

Flat heat pipe mechanism extracts heat from light emitting substrate to prevent failure during continuous operation.

A curved support structure forms an oscillating heat pipe between two plates to diffuse heat across multiple faces.

Segmented optical layers with through-holes enable convection cooling, resolving the trade-off between thermal management and light transmission.

A rotating wavelength conversion element distributes excitation light across its surface to manage thermal loads in high-brightness illumination systems.

Thermal vias and bumps in a light source module conduct heat from laser diodes, resolving insufficient radiation performance.

Louver vents on a metal shell improve natural convection airflow while maintaining structural integrity.

Rotating the LED module relative to the base enables asymmetric light emission, resolving directional control without adding complex mechanical structures.

A vapor chamber element bridges spatial gaps with heat fins to enable passive thermal dissipation.

A heat dissipation member uses fins with greater density at the center to improve thermal transfer from reflective light modulation elements.

A segmented LED array paired with a finned chassis plate and angled reflective surfaces directs light output.

Angled radiating fins on a lamp base expand heat exchange surfaces, solving poor ventilation in indoor plant growth setups.

An integrated metal structure combines reflective surfaces and a heat sink to dissipate junction heat, resolving total internal reflection losses.

Bayonet mount adapter couples interchangeable LED modules to heat sinks.

A thermally-conductive dielectric layer conducts heat from a wavelength conversion material while reflecting unabsorbed excitation light.

A backlight module uses a heat dispersing plate attached to the light source for thermal management.

Segmented heat sinks and low conductivity retainers isolate thermal paths to reduce heat influence on liquid crystal panels under high brightness.

Floating spring mounting compensates for assembly tolerances and material aging to ensure stable contact pressure and efficient heat dissipation.

Differentiating thermal conductivity in the front cover reduces thermal strain and solvent cracks while shortening welding time.

A lighting device uses asymmetric light source boards to manage heat distribution across a light guide plate.

Sealed color wheel housing uses filtered air channels to circulate cooling airflow, preventing dust accumulation that degrades luminous efficiency.