LED Module Mounting with Floating Spring for Stable Contact Pressure
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Solution Overview
Problem
Existing methods for mounting LED modules on heat sinks often experience undesirable changes in contact pressure over time due to torque variations, component tolerances, and material aging, leading to inefficient heat dissipation.
Innovation Solution
A mounting arrangement featuring a ring-shaped pressure element with a floating spring mounting system, which ensures a constant pressing force by compensating for assembly tolerances and material changes, and includes a screw connection with a shoulder surface to maintain a fixed distance, along with additional spring elements and screws for uniform pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED module is attached directly to the heat sink by screwing with specific torque, then initial contact pressure is achieved, but contact pressure changes over time due to torque variations, component tolerances, and material aging
Solution Approach 1:
The patent introduces a dynamic mounting system where the LED module can move slightly relative to the heat sink through a resilient connection. This allows the system to adapt to dimensional changes and maintain optimal contact pressure over time, transforming a static rigid connection into a dynamic adaptive one that compensates for aging and tolerance variations
Solution Approach 2:
The patent changes the physical state of the mounting connection from rigid to compliant by introducing elasticity. The resilient element allows controlled deformation and movement, enabling the system to maintain consistent contact pressure despite changes in torque, temperature, and material properties over time
2Ease of manufacture
If rigid screw mounting is used to secure LED module, then assembly is simple, but assembly tolerances and material changes cause gaps that impede heat dissipation
Solution Approach 1:
The patent employs a resilient mounting element that acts as a flexible connection between the LED module and heat sink. This flexible element compensates for manufacturing tolerances and maintains uniform contact pressure across the interface, eliminating gaps that would otherwise form due to rigid mounting constraints
3Force
If the LED module is pressed against heat sink by a cover with screws and springs, then contact force is applied, but the structure becomes more complex
Solution Approach 1:
The patent combines the functions of the cover, springs, and mounting mechanism into an integrated resilient mounting element. This merged structure eliminates the need for separate covers and fastening components, achieving the necessary contact force while significantly reducing overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement provides a consistently uniform pressure force over the long term, ensuring efficient heat transfer and easy assembly and replacement of the LED module, while maintaining optimal optical properties and light tightness.
Implementation Method 1
a spring element for a floating mounting of the pressure element relative to the surface
Implementation Method 2
the spring element is provided to be arranged, on the one hand, against the head of the screw and, on the other hand, against the pressure element
Implementation Method 3
enabling good dissipation of heat generated during operation of the LED module
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
An arrangement for mounting an LED module (1) on a surface (21) of a heat sink (2) has a pressure element (3) for pressing the LED module (1) against the surface (21) and a spring element (4) for a floating bearing of the pressure element (3) relative to the surface (21).