XR Glasses Light Source Module Thermal Vias and Bumps
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Solution Overview
Problem
Conventional light source modules for XR glasses have insufficient heat radiation performance due to inadequate thermal conductivity in their packaging, which hampers the efficient dissipation of heat generated by laser diodes.
Innovation Solution
A light source module design featuring a chip-on-carrier with a high thermal conductivity base, a planar lightwave circuit with a bonded substrate, and a package structure incorporating thermal vias and bumps with high thermal conductivity, where the bumps are in contact with the thermal vias or bonded via a metallic pad, creating an efficient heat radiation path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional package structures are used for light source modules, then the device complexity is low and ease of manufacture is good, but the heat radiation performance is insufficient
Solution Approach 1:
The package structure is segmented into multiple functional layers: a substructure forming the bottom surface, thermal vias penetrating through the substructure for heat conduction, and bumps provided on the substructure to establish thermal contact with the planar lightwave circuit. This segmentation allows each component to specialize in a specific heat transfer function, resolving the contradiction between maintaining manufacturing simplicity and improving heat radiation performance.
Solution Approach 2:
The bumps serve as an intermediary element between the planar lightwave circuit and the thermal vias in the package substructure. These bumps establish direct thermal contact pathways, mediating heat transfer from the lightwave circuit through the bumps into the thermal vias, thereby enabling efficient heat radiation without requiring complex integrated thermal management structures.
2Temperature
If thermal vias are added to the package to improve heat radiation, then the heat radiation performance improves, but the manufacturing precision requirements increase
Solution Approach 1:
The thermal vias are pre-formed in the package substructure before mounting the light source module components. This preliminary action allows the thermal via positions to be precisely established in advance, and the subsequent alignment of bumps with these pre-positioned thermal vias is simplified, reducing the overall manufacturing precision requirements while maintaining effective heat radiation pathways.
3Temperature
If the base of the chip-on-carrier has high thermal conductivity, then the heat transfer from laser diode improves, but the cost of materials increases
Solution Approach 1:
High thermal conductivity material is applied locally only to the base of the chip-on-carrier where the laser diode is mounted, rather than throughout the entire light source module. This localized application of high thermal conductivity material focuses the thermal management resources where they are most needed (at the heat generation point) while controlling overall material costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances heat radiation performance by allowing heat generated by the laser diode to be efficiently transferred along the chip-on-carrier base, substrate, bumps, and thermal vias, effectively addressing the thermal conductivity limitations of conventional modules.
Implementation Method 1
heat generated by a laser diode and moved to a substrate of a planar lightwave circuit via a base of a chip-on-carrier can be efficiently radiated along a heat radiation path passing through a bump and a thermal via in that order
Data Source
AI summary
A light source module includes a chip-on-carrier having a base and a laser diode, a planar lightwave circuit having a substrate and an optical waveguide, and a package having a housing portion configured to house the chip-on-carrier and the planar lightwave circuit. The housing portion has a substructure configured to form a bottom surface, one or more thermal vias penetrating through the substructure, and one or more bumps provided on the substructure. At least one of the bumps is arranged in contact with the planar lightwave circuit and arranged at a position at least partially overlapping the thermal vias when seen from above. The bumps come in contact with the thermal vias or the bumps and the thermal vias are bonded via a metallic pad.