LED Module with Refractive Index-Matched Encapsulant
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Solution Overview
Problem
Existing LED modules suffer from low luminous efficiency due to light passing through air mediums, moisture sensitivity, and poor heat radiation efficiency, leading to interface loss and damage.
Innovation Solution
An LED module design featuring a lens group, seal ring, LED illuminant, and heat sink with encapsulant filling the confined space between these components, using a refractive index-matched encapsulant to improve light coupling and a heat sink holder for efficient heat dissipation, including die bonding and high-conductive insulation materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light passes through air medium in existing LED modules, then the structure is simple, but interface loss occurs resulting in low luminous efficiency
Solution Approach 1:
The patent introduces encapsulant as an intermediary medium filling the space between the lens group and heat sink. This encapsulant has refractive index matched to both the lens and LED chip, serving as an optical bridge that reduces interface loss and improves light transmission efficiency while maintaining structural simplicity.
Solution Approach 2:
The patent changes the optical parameter (refractive index) of the medium surrounding the LED chip from air (n≈1.0) to encapsulant with refractive index between 1.4-3.0, which is matched to the lens and chip materials. This parameter change reduces optical impedance mismatch and minimizes interface loss, improving luminous efficiency.
2Device complexity
If no fillers are present between lens group and heat sink in existing LED modules, then the structure is simple, but moisture enters causing damage to LED illuminant
Solution Approach 1:
The encapsulant serves as a protective intermediary that fills the confined space between the lens group and heat sink, creating a sealed environment that prevents moisture ingress while maintaining structural simplicity. The encapsulant acts as both optical medium and protective barrier.
Solution Approach 2:
The encapsulant creates an inert, moisture-free environment around the LED illuminant by filling and sealing the confined space. This inert environment protects the sensitive LED components from moisture damage while maintaining the simplicity of the overall structure.
3Device complexity
If heat is transmitted only through bottom of heat sink holder in existing LED modules, then the structure is simple, but radiation efficiency is poor
Solution Approach 1:
The encapsulant performs multiple functions: it serves as an optical medium for light transmission and simultaneously acts as a thermal conduction path for heat dissipation. This multi-functionality improves heat radiation efficiency without increasing structural complexity, as the same encapsulant material conducts heat from the LED chip to the heat sink and external environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light out-coupling efficiency by 10-15% and provides waterproof performance while improving heat radiation efficiency by allowing heat to be dissipated both to the circuit board and external environment.
Implementation Method 1
encapsulant is filled in a confined space formed among the lens group, the seal ring, the sealant and the heat sink through the process of injection. Preferably, the encapsulant is transparent with refractive index of 1.4 ̃3, which is slightly higher than the one of the lens of the lens group and slightly lower than the one of the LED chip.
Implementation Method 2
the heat sink holder is made of high conductive insulation materials. Preferably, the high conductive insulation materials include high conductive ceramic materials such as AlN.
Implementation Method 3
LED chip technology and encapsulation technology, more and more LED products have been applied to lighting field, especially white light LED of high power.
Data Source
AI summary
A LED module includes a lens group, an LED illuminant, a circuit board and a heat sink; the LED illuminant includes an LED chip and a heat sink holder; the LED chip is attached to the heat sink holder which is disposed on the circuit board by Surface Mounted Technology; the lens group covers the heat sink, and is located above the LED chip; encapsulant is filled in a confined space formed between the lens group and the heat sink through a process of injection. Compared with the prior art, in the LED module of the present invention, the encapsulant replaces the original air medium in the transmission process of the light emitted by the LED chip; moreover, matching between the refractive index of the encapsulant and the lens of the lens group improves the light out-coupling efficiency. Lighting efficiency is improved by 10˜15% compared with the prior art.