LED Heat Dissipation Casing with Chamfered Air Inlets
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Solution Overview
Problem
Conventional light emitting devices face reduced heat dissipation effectiveness due to obstructed air inlets caused by side splicing of components, which limits the ventilating area and interferes with heat dissipation processes.
Innovation Solution
The design incorporates a heat dissipation casing with chamfered surfaces and non-coplanar holes, allowing for separate air inlet and outlet areas that do not interfere with each other, even during side splicing, and includes a fan and heat dissipation components for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If air inlet and air outlet are disposed on the side cover and upper cover respectively, then heat dissipation function is provided, but the air inlet is shielded due to side splicing of components, reducing the air inletting area and heat dissipation effect
Solution Approach 1:
The patent introduces chamfered surfaces at the junctions between side covers and upper cover, creating a third dimensional plane for air inlet holes. This moves the air inlet function from the two-dimensional side cover surface to a chamfered surface that extends into the depth of the housing, effectively adding a dimensional layer that prevents shielding during side splicing operations.
Solution Approach 2:
The air inlet function is segmented into two separate locations: air inlet holes on the upper cover and air inlet holes on the chamfered surfaces. This segmentation ensures that if one location is shielded or blocked, the other can still provide adequate air inletting area for heat dissipation.
2Loss of energy
If air inlet and air outlet holes are coplanar, then manufacturing is simplified, but air inletting and exhaust paths interfere with each other, reducing heat dissipation efficiency
Solution Approach 1:
By placing air inlet holes on chamfered surfaces that are at a different plane than the upper cover surface, the patent creates non-coplanar air inlet and outlet paths. This dimensional separation allows air to flow through distinct paths - entering through the chamfered surfaces and exiting through the upper cover - eliminating interference between inletting and exhaust while maintaining manufacturing feasibility through standardized drilling processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration preserves effective ventilating areas and improves heat dissipation efficiency by preventing interference between air inlet and outlet, ensuring effective cooling and compatibility with applications like UV curing.
Implementation Method 1
the heat dissipation method includes natural convection and forced convection. For example, if the heat produced by the light emitting component is removed by natural convection
Implementation Method 2
the heat produced by the operation of the light emitting component can be removed quickly
Data Source
AI summary
A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module.