Light Emitting Device Flat Heat Pipe Cooling
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Solution Overview
Problem
LED lighting equipment faces failure due to heat generated during continuous light emission, as existing technologies inadequately address heat removal from light emitting elements.
Innovation Solution
A light emitting device featuring an insulating substrate with a circuit pattern layer, bonded light emitting elements, a phosphor layer, a flat heat pipe mechanism for heat removal, and a cooling unit to manage temperature, including a heat sink and air flow for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If light emitting elements continuously emit light, then light emission function is maintained, but heat accumulates causing element failure
Solution Approach 1:
The patent extracts the heat removal function from the light emitting substrate by introducing a separate flat heat pipe mechanism. The heat pipe is bonded to the rear surface of the substrate, extracting heat away from the light emitting elements through phase change of the working fluid inside the heat pipe channels, thereby enabling continuous operation without heat accumulation
Solution Approach 2:
The flat heat pipe acts as an intermediary between the light emitting substrate and the cooling unit. It transfers heat from the substrate to the cooling unit through its working fluid, which undergoes phase change (evaporation and condensation) to efficiently transport heat away from the light emitting elements
2Loss of energy
If conventional cooling methods are used, then cooling function is provided, but heat removal efficiency is insufficient
Solution Approach 1:
The flat heat pipe utilizes phase transitions of its working fluid (evaporation at the heating section and condensation at the cooling section) to achieve highly efficient heat transfer. This phase change mechanism enables the heat pipe to remove heat much more effectively than conventional conduction-based cooling methods
Solution Approach 2:
The patent transitions from point-contact or line-contact cooling methods to area-contact cooling by using a flat heat pipe that bonds to the entire rear surface of the light emitting substrate. This dimensional expansion of the cooling interface significantly increases heat removal efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively maintains the light emitting substrate's temperature within a safe range, preventing failure and ensuring continuous operation by efficiently removing heat generated during light emission.
Implementation Method 1
a flat heat pipe mechanism that removes heat from the light emitting substrate, a temperature of which is increased with light emission of the at least one light emitting element
Implementation Method 2
a flat heat pipe mechanism that removes heat from the light emitting substrate
Implementation Method 3
a cooling unit that cools the flat heat pipe mechanism
Implementation Method 4
the cooling unit cools the flat heat pipe mechanism by applying an air flow to the heat sink
Implementation Method 5
a heat sink that dissipates heat of the flat heat pipe mechanism
Implementation Method 6
a heat sink that dissipates heat of the flat heat pipe mechanism
Implementation Method 7
a phosphor layer that is disposed on one surface side of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the at least one light emitting element is used as excitation light, is in a visible light region
Data Source
AI summary
A light emitting device of the present invention includes a light emitting substrate including an insulating substrate, a circuit pattern layer disposed on one surface of the insulating substrate, and at least one light emitting element bonded to the circuit pattern layer, a flat heat pipe mechanism that removes heat from the light emitting substrate, a temperature of which is increased with light emission of the at least one light emitting element, and a cooling unit that cools the flat heat pipe mechanism.