LED Lighting Apparatus with Heat Dissipation Fins
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Solution Overview
Problem
High-watt LEDs in streetlights suffer from reduced service life due to inefficient heat dissipation, leading to increased temperatures that affect electrical components, and are prone to damage from external shocks, which compromises uniform illumination on the ground.
Innovation Solution
The LED lighting apparatus features a chassis plate with heat-dissipation fins and air holes, a reflective plate with specific angles to enhance light distribution, and a spread plate with grooves to ensure uniform illumination, while using low-output LEDs to reduce costs and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-watt LEDs are used to improve illumination intensity, then the illumination onto the ground is improved, but the service life of LED devices is reduced due to heat deterioration
Solution Approach 1:
The LED device is divided into multiple LED chips arranged in a matrix pattern, distributing the light-emitting function across multiple smaller units. This segmentation allows for better heat management while maintaining high illumination intensity, as each chip generates less heat individually while collectively providing the required lighting output.
Solution Approach 2:
A heat dissipation structure comprising a heat dissipation plate and heat dissipation fins is introduced as an intermediary between the LED chips and the environment. The heat dissipation plate is thermally coupled to the LED chips, and the fins extend from the plate to increase surface area for heat transfer to the surrounding air, effectively managing thermal energy without compromising LED service life.
2Illumination intensity
If high-watt LEDs are used to improve illumination, then the illumination onto the ground is improved, but the temperature of lighting apparatuses is increased affecting electrical components
Solution Approach 1:
The heat dissipation plate acts as a thermal intermediary, capturing heat from the LED chips and transferring it to the heat dissipation fins. This intermediary structure prevents heat accumulation in the housing and electrical components by providing a dedicated thermal management pathway, thus maintaining lower operating temperatures for sensitive electrical parts while preserving high illumination output.
Solution Approach 2:
The heat dissipation fins extend in a direction away from the ground (vertically or laterally), utilizing three-dimensional space to maximize surface area for heat dissipation. This dimensional expansion allows efficient heat transfer without increasing the footprint of the lighting apparatus, effectively managing temperature while maintaining compact design.
3Illumination intensity
If high-watt LEDs are used to improve illumination, then the illumination onto the ground is improved, but the protective member is easily damaged due to external shock
Solution Approach 1:
The LED device is segmented into multiple smaller LED chips rather than using a single high-power LED. This segmentation reduces the overall mass and concentration of heat-generating components, thereby reducing the impact of external shocks on the protective member. The distributed arrangement of chips also reduces thermal stress concentration, improving the durability of the protective cover.
4Illumination intensity
If the light-emitting surface is inclined at a small angle to achieve uniform illumination, then the uniform illumination is improved, but the viewing angle requirement is constrained
Solution Approach 1:
The LED device is divided into multiple LED chips arranged in a matrix, with each chip having its light-emitting surface inclined at a specific angle (5-15 degrees) relative to the ground. This segmentation allows the light from multiple chips to overlap and combine, creating uniform illumination on the ground while maintaining flexibility in the viewing angle. The matrix arrangement ensures that light is distributed evenly across the target area regardless of the inclination angle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maximizes heat dissipation and light efficiency, providing uniform illumination on the ground, extending the life cycle of LEDs and preventing overheating, while also protecting against external damage.
Implementation Method 1
a plurality of heat dissipation fins disposed at a side opposite to the panel of the chassis plate
Implementation Method 2
the reflective plate extending from the panel, wherein the reflective plate consists of a first portion slantly extended at a second angle
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The present invention relates to an LED lighting apparatus which has uniform illumination and increases heat-dissipation effects to improve stability. The LED lighting apparatus includes: a panel having a plate shape, wherein the panel has a first plane and a second plane disposed on the side opposite to that of the first plane; a light-emitting part disposed on the first plane of the panel and including a plurality of LED devices, wherein the light-emitting part has a light-emitting surface parallel to the first plane and inclined at a first angle such that the light-emitting surface forms an acute angle with the ground; and a reflective plate extending from the panel. The reflective plate includes a first portion extending at an incline so as to form a second angle with the ground that is smaller than the first angle, a second portion extending from the panel at an incline in a direction away from the ground, and a third portion connecting the first portion to the second portion.