Backlight Module Flexible Circuit Board Stacked Segments
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Solution Overview
Problem
Conventional backlight modules for large or high-brightness liquid crystal displays face challenges in achieving a thin profile due to the increased width of flexible circuit boards required for light-emitting diodes, leading to thickness issues and poor heat dissipation, as well as high costs and fabrication complexities.
Innovation Solution
A backlight module design featuring a flexible circuit board with a first portion for light-emitting diodes and stacked second portions, allowing for a compact U-shaped housing that clips a light guide plate, enabling efficient packing of the light-emitting diode light bar within the module while maintaining sufficient wiring area and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the width of the flexible circuit board is increased to provide sufficient wiring area for light-emitting diodes, then the wiring area is improved, but the thickness of the backlight module is increased
Solution Approach 1:
The flexible circuit board transitions from a two-dimensional planar layout to a three-dimensional folded structure. The board is bent into an L-shape with folding lines, allowing wiring to extend in multiple spatial dimensions rather than requiring increased width in a single plane. This dimensional transformation enables sufficient wiring area while maintaining compact module thickness.
Solution Approach 2:
The flexible circuit board is folded back onto itself in an L-shaped configuration, with portions of the board nested within the module's depth space. The folded sections are positioned within the housing structure, effectively nesting the wiring path within the existing three-dimensional envelope rather than extending outward in width.
2Area of stationary object
If the flexible circuit board is bent to L-shape and adhered to side plates to reduce width, then the width is reduced, but the thickness problem remains in larger or higher brightness displays
Solution Approach 1:
The circuit board utilizes the depth dimension (z-axis) by folding back onto itself, creating an L-shaped three-dimensional structure. This allows the wiring to achieve sufficient length and area by extending into the depth space of the module rather than requiring increased width, thereby solving the thickness problem in larger displays.
Solution Approach 2:
The flexible circuit board is divided into multiple segments or sections separated by folding lines. These segmented portions are arranged in an L-shaped configuration, with each segment serving specific wiring functions. The segmentation enables compact folding while maintaining adequate wiring area for high-brightness applications.
3Area of stationary object
If the flexible circuit board is bent to U-shape and adhered to three side plates to further reduce width, then the width is reduced, but the fabrication difficulty is greatly increased
Solution Approach 1:
The circuit board is divided into manageable segments by folding lines, creating an L-shaped structure with distinct sections. This segmentation simplifies the folding and assembly process compared to a continuous U-shape bend, as each segment can be independently positioned and adhered to the housing, reducing fabrication complexity.
Solution Approach 2:
The L-shaped folded configuration utilizes the depth dimension to achieve compact width while maintaining a simpler single-bend geometry compared to a U-shape. This dimensional approach provides sufficient wiring area without requiring the complex double-bend U-shaped folding, thereby easing manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the thickness of the backlight module, increases the layout space for light-emitting diodes, and improves heat dissipation without increasing costs, facilitating the development of larger and brighter liquid crystal displays.
Implementation Method 1
at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light
Implementation Method 2
the second portions are stacked with respect to each other... improves heat dissipation
Data Source
AI summary
A backlight module, an application and a fabrication method thereof are described. The backlight module comprises: a light guide plate; a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and at least one light-emitting diode (LED) light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.