Printed Circuit Aspects TRIZ Cases

A segmented flat cable uses independent flexible substrates to enable reliable signal transmission through pivoting mechanisms.

A board design uses shared heater terminal pads between adjacent pad areas to reduce the number and area of terminal pads.

Dispersed halogen flame retardant prevents dissociation, resolving heat resistance trade-offs in printed wiring boards.

A portable lighting apparatus projects a protective light curtain around users to inactivate airborne pathogens using high-intensity narrow spectrum and far UVC wavelengths.

Ultraviolet irradiation generates ozone to dissolve organic smears while ultrasonic vibration removes inorganic residues, eliminating chemical waste treatment.

Segmented support points on a carrier substrate position a filter element at 30–200 μm from the sensor, preventing microparticle-induced light spots.

A substrate design featuring a hollowed region enables non-destructive X-ray thickness measurement of test contacts.

Segmented LED substrates with independent electrical and thermal paths enable higher operating currents by conducting heat away from junctions.

A halogen-free epoxy resin composition utilizes DOPO-modified curing agents and cyanate resins to enhance thermal stability.

Trimming anisotropic conductive material protrusions on flexible wiring boards prevents electrical leakage while maintaining reliable component connections.

A high voltage connector positions a pad within a plate to create an equipotential region.

Stacked flexible circuit board segments increase wiring area and improve heat dissipation while reducing backlight module thickness.

Ultrasonic welding fuses conductive bonding pads on flexible circuits, reducing manufacturing complexity while maintaining structural integrity.

Segments insulating film removal into ashing and wet cleaning steps to eliminate surface roughness caused by simultaneous etching of conductors.

A multilayer substrate connects first through hole pillars in cascade with a public line to eliminate pads and increase available wiring area.

A tubular sensor assembly positions analyte sensors on interior and exterior substrate surfaces to increase density.

Encapsulating components in uncured solid resin forms clusters that fill carrier recesses, resolving heat removal challenges during miniaturization.

Segmenting circuitry into stacked assemblies reduces board design complexity while scaling controllable beams in phased array antennas.

Via voids surround differential signal vias to enhance coupling and reduce electromagnetic interference in high-frequency PCB designs.

A circuit board manufacturing method uses electroplated relievo patterns to create high-density interconnects.

Machining recesses in thick conductive layers before chemical etching reduces solution usage, minimizes substrate damage, and maintains thermal conductivity.

Optimized glass cloth parameters prevent pinholes in thin substrates while ensuring consistent laser drillability.

A coil-integrated printed circuit board uses alternating thick and thin metallic foils to form high-current coil patterns.

A flexible circuit board positions bonding pins within substrate edges to prevent conductive particle leakage.

A modified cycloolefin copolymer resin forms thermosetting laminates with low dielectric constants.

A circuit board conductive terminal features a segmented design with portions embedded in an insulating layer to enhance electrical connectivity.

Electroless silver underlayers reflect trapped light through solder masks, resolving absorption losses in LED packages.

Stacking parallel metal wirings in multiple layers minimizes the non-display region area while preventing signal interference between adjacent conductors.

Segmented PCB modules integrate sensors to transmit real-time responder location and weather data.

Segmented via conductors with inner wall coatings improve wiring density while maintaining signal transmission quality in high-frequency applications.

Asymmetric terminal spacing on a flexible printed circuit board shortens connecting lines, reducing impedance and power consumption in display devices.

A printed circuit board with a coaxial via structure featuring a hollow via surrounded by a metal sleeve and insulating material.

Through holes and communicating recesses in the pin mount guide bent pins to prevent detachment and solder breakage during assembly.

Segmented signal lines with varying characteristic impedances improve digital signal transmission on printed circuit boards.

A dual output autotransformer topology uses three windings on a single ferrite binocular core to achieve wideband signal processing.

An embedding member fills the pit formed by a protruding conductive portion, replacing air layers to suppress heat release capability deterioration.

Segmenting laser ablation into blind and trough steps prevents core-metal interface separation, improving manufacturing yield.

Two-stage electroplating with adhesion promoter reduces height differences below 2 μm and etching time.

A conductive rubber element bridges force sensor tabs to circuit board leads, establishing reliable electrical connections without soldering.

A perforated mask formed from shaped parts aligns circuit board substrates during pressing, eliminating registration hole damage and variability.

Segmented lamination and backdrilling form metallized blind holes that double the space between wafers while maintaining connector density.

A capacitance-to-voltage converter monitors sense electrode signals to detect layer peeling in electronic modules.

Thermal expansion of fixing pins anchors flexible circuit boards without glue, preventing reflector warping and display mura defects.

Curable nitrogen-containing polyarylene ether copolymers paired with phosphorus flame retardants deliver low dissipation factor and high copper peel strength.

A multilayer wiring board embeds a dissimilar metallic layer in a concave via hole bottom to enhance connection reliability.

Segmented rigid PCBs nest inside a mobile device housing, linked by a thin flexible circuit that reduces signal loss and interference.

Inkjet printing merges antenna arrays with integrated circuits on one flexible substrate, reducing fabrication complexity.

Gibbsite aluminum hydroxide and magnesium oxide fillers boost thermal conductivity while maintaining drill workability and UL-94 V-0 fire retardancy.

A DOPO derivative epoxy composite provides non-halogen flame retardancy and low dielectric properties.