Halogen-Free Epoxy Resin Composition for PCBs
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Solution Overview
Problem
Existing epoxy resin compositions in printed circuit boards, particularly those containing halogen-based flame retardants, face issues with environmental pollution, moisture absorption, and inadequate performance in high-frequency applications due to high dielectric constants and dissipation factors, which are not adequately addressed by conventional thermosetting resins like phenolic resin.
Innovation Solution
A halogen-free epoxy resin composition comprising 100 parts by weight of naphthalene-based epoxy resin, 10 to 25 parts by weight of DOPO modified curing agent, 25 to 45 parts by weight of cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of non-DOPO flame retardant, and 0.5 to 15 parts by weight of accelerating agent, which enhances heat resistance, reduces moisture absorption, and lowers dielectric constants and dissipation factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogen-containing flame retardant is used, then flame retardancy is improved, but environmental pollution and toxic gas generation occur
Solution Approach 1:
The patent changes the chemical composition parameters by replacing halogen-containing flame retardants with halogen-free alternatives (specifically using phosphorus-containing compounds like DOPO and cyanate resin). This parameter change maintains flame retardancy while eliminating environmental pollution and toxic gas generation associated with halogen materials.
Solution Approach 2:
The patent employs a composite resin system combining epoxy resin with multiple flame retardant components (DOPO modified curing agent, cyanate resin, bismaleimide, and non-DOPO flame retardant). This composite approach achieves synergistic flame retardancy without relying on halogen-containing substances, thus resolving the contradiction between flame safety and environmental harm.
2Stability of the object's composition
If phenolic resin is used as curing agent, then thermosetting properties are improved, but dielectric constant and dissipation factor increase
Solution Approach 1:
The patent modifies the curing agent composition by using DOPO modified curing agents instead of conventional phenolic resins. This chemical parameter change maintains the thermosetting properties necessary for structural stability while significantly reducing the dielectric constant and dissipation factor, thereby improving high-frequency electrical performance.
Solution Approach 2:
The patent introduces cyanate resin and bismaleimide as intermediary substances that mediate between the epoxy resin and curing agent system. These intermediaries contribute to crosslinking and thermosetting properties while having lower impact on dielectric properties compared to phenolic resins, thus resolving the contradiction between structural stability and electrical performance.
3Strength
If hydroxyl group is increased through epoxy-phenolic reaction, then crosslinking density is improved, but moisture absorption increases
Solution Approach 1:
The patent changes the chemical composition by using halogen-free and phosphorus-containing flame retardants with specific molecular structures that do not introduce excessive hydroxyl groups. This parameter change allows achieving adequate crosslinking density through alternative mechanisms (such as cyanate and bismaleimide crosslinking) while minimizing moisture-absorbing hydroxyl groups, thus resolving the contradiction between strength and moisture resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high glass transition temperature, low dielectric constant, low dissipation factor, high heat resistance, and high storage modulus, improving the thermal stability and flame retardancy of printed circuit boards while avoiding environmental hazards associated with halogen-based materials.
Implementation Method 1
the halogen-free epoxy resin composition, including: (a) 100 parts by weight of a halogen-free naphthalene based epoxy resin; (b) 10 to 25 parts by weight of DOPO modified curing agent
Implementation Method 2
25 to 45 parts by weight of cyanate resin; (d) 35 to 60 parts by weight of bismaleimide
Implementation Method 3
45 to 65 parts by weight of non-DOPO flame retardant; halogen-free flame retardant printed circuit board has become the key development in this field
Data Source
AI summary
A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.