Flexible Circuit Board Bonding Pin Geometry for Short Circuit Prevention
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Solution Overview
Problem
The manufacturing of bendable display products faces challenges in ensuring the bending performance and reliability of the touch module, particularly due to the risk of short circuits, difficulty in bending, and substrate breakage during bonding.
Innovation Solution
A flexible circuit board with a first bonding area and a bending area is designed, featuring a flexible substrate, first bonding pins, a conductor layer, and a protective layer. The bonding pins are arranged such that their edges do not extend to the substrate edge, and notches may be included to enhance conductive particle flow, preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the flexible circuit board is thinned to improve flexibility, then the bending performance is improved, but the substrate becomes easy to break during bonding and when bending
Solution Approach 1:
A protective film is applied to the back side of the flexible circuit board in the bending area before bonding operations. This protective film acts as a cushioning layer that prevents substrate breakage during bonding and bending operations, allowing the substrate to be thin enough for flexibility while maintaining sufficient strength during manufacturing and operation.
2Area of stationary object
If the bonding pins are arranged close to the substrate edge to maximize bonding area, then the bonding area is increased, but the conductive particles may flow out and cause short circuits
Solution Approach 1:
The bonding pins are designed with a structure where the edge line of each bonding pin is located within the substrate edge, creating a preventive geometry that stops conductive particles from flowing out and causing short circuits. This preliminary design feature prevents the harmful effect before it can occur, allowing the bonding pins to be positioned optimally for maximum bonding area while inherently preventing short circuit risks.
3Ease of operation
If the flexible circuit board is made thin to improve flexibility, then the bending performance is improved, but the board becomes difficult to bend and prone to deformation
Solution Approach 1:
The protective film is applied beforehand to provide structural support and prevent deformation during bending operations. This cushioning layer maintains the structural stability of the thin flexible circuit board while allowing it to achieve the necessary flexibility for bending applications.
Solution Approach 2:
The flexible circuit board employs a composite structure combining the flexible substrate with a protective film layer. This composite material approach provides both the flexibility needed for bending and the structural stability to prevent deformation, resolving the contradiction between thinness for flexibility and stability for structural integrity.
Data Source
AI summary
A flexible circuit board has a first binding area and a bending area. The flexible circuit board includes a flexible substrate, a conductor layer, a first protective layer, and a plurality of first binding pins. The plurality of first binding pins is arranged in the first binding area on the flexible substrate. The orthographic projection on the flexible substrate of an edge line of each first binding pin is located within the edge of the flexible substrate, wherein the edge line is located at an end along the extension direction of the first binding pin. The conductor layer is arranged in the bending area on the flexible substrate. The conductor layer is connected with the first binding pins. The first protective layer is arranged on the side of the conductor layer away from the flexible substrate.