Coil-Integrated PCB with Thick-Thin Foil Layers for Heat Suppression
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Solution Overview
Problem
In coil-integrated printed circuit boards used in switching power supply apparatuses, excessive heat generation due to high current flow through coil patterns leads to temperature increases, potentially damaging electronic components and degrading magnetic device performance, while increasing the board's size and reducing mounting density.
Innovation Solution
A coil-integrated printed circuit board design featuring alternating layers of thick and thin metallic foils for the coil patterns, allowing for high-density electronic component mounting by mixing thick electric conductors on outer layers and thin conductors on inner layers, which suppresses heat generation and maintains performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the coil pattern width or thickness is increased to reduce heat generation, then heat generation is suppressed, but the board size increases and mounting density decreases
Solution Approach 1:
The patent applies local quality by using thick electric conductors specifically in the coil pattern regions where heat generation occurs, while using thin electric conductors in other regions where mounting density is required. This localized differentiation allows heat suppression in critical areas without compromising overall board compactness and component density.
Solution Approach 2:
The patent segments the board into different regions with different conductor thicknesses - thick conductors for coil patterns and thin conductors for other wiring. This segmentation enables targeted heat management while maintaining high mounting density in non-coil areas, resolving the contradiction between heat suppression and compactness.
2Loss of energy
If thick electric conductors are used throughout the board to reduce heat generation, then heat generation is suppressed, but electronic components cannot be mounted at high density
Solution Approach 1:
The patent implements local quality by assigning different conductor thicknesses to different functional regions: thick conductors (50-200 μm) in coil pattern areas for heat suppression, and thin conductors in other areas for high-density component mounting. This regional differentiation simultaneously achieves both heat suppression and high mounting density.
Solution Approach 2:
The board is segmented into coil pattern regions with thick conductors and non-coil regions with thin conductors. This segmentation allows the thick conductors to suppress heat only where needed in the coil patterns, while thin conductors enable high-density mounting elsewhere, thus resolving the contradiction between heat suppression and mounting density.
3Loss of energy
If the coil pattern cross-sectional area is increased to reduce heat generation, then heat generation is suppressed, but the degree of freedom in coil pattern design decreases
Solution Approach 1:
The patent applies local quality by using thick electric conductors specifically in the coil pattern portions where heat generation occurs, while maintaining thin electric conductors in other wiring portions. This allows the coil patterns to have sufficient cross-sectional area for heat suppression without constraining the overall board layout and component arrangement flexibility.
Solution Approach 2:
The patent segments the conductor system into thick conductors for coil patterns and thin conductors for other wiring. This segmentation enables independent optimization of coil patterns for heat suppression while maintaining design freedom for other board elements, thus resolving the contradiction between heat suppression and design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the formation of a predetermined number of coil turns with reduced heat generation, allowing for high-density electronic component mounting and compact apparatus size while maintaining magnetic device performance.
Implementation Method 1
The coil pattern is made of a metallic foil having electric conductivity, for example, a copper foil
Implementation Method 2
A magnetic device such as a choke coil or a transformer is used in the switching power supply apparatus
Implementation Method 3
when a current flows through the coil patterns, heat is generated from each of the coil patterns
Data Source
AI summary
A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.