DOPO Derivative Epoxy Composite for High-Frequency Substrates
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Solution Overview
Problem
Current methods for preparing DOPO derivative-based flame retardants for epoxy composites have low yield and high costs, and there is a lack of effective additive-type flame retardants for high-frequency substrates, which are essential for electronic materials requiring low dielectric constants, high heat resistance, and non-halogen flame retardancy.
Innovation Solution
A method involving a dehydration reaction between compounds (B) and (C) in the presence of a catalyst and solvent, with specific molar ratios and reaction conditions, to produce a DOPO derivative that can be easily purified and combined with epoxy composites, using a curing agent and inorganic fillers to create a non-halogen flame-retardant epoxy composite with low dielectric properties and high heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additive-type DOPO derivative flame retardant is applied in epoxy resin, then flame retardancy and environmental friendliness are improved, but preparation cost increases and yield decreases
Solution Approach 1:
The patent changes the reaction parameters including using toluene as solvent, adding p-toluenesulfonic acid as catalyst, and controlling the molar ratio of reactants to achieve high-yield preparation of DOPO derivative flame retardant with good purification characteristics
Solution Approach 2:
The patent introduces a catalyst (p-toluenesulfonic acid) and solvent (toluene) as intermediaries to facilitate the dehydration reaction between DOPO and epichlorohydrin, improving both the reaction efficiency and the ease of product separation
2Reliability
If traditional flame retardants are used, then flame retardancy is achieved, but smoke amount increases and poisonous/corrosive gases are generated
Solution Approach 1:
The patent converts the harmful halogen-containing flame retardants into beneficial non-halogen DOPO derivatives that produce less smoke and no poisonous or corrosive gases during combustion, while maintaining effective flame retardancy
Solution Approach 2:
The patent creates a composite material system where DOPO derivative is chemically bonded to epoxy resin, forming a reactive flame retardant that integrates flame protection with the base polymer structure
3Speed
If high-frequency substrate materials are developed, then data transfer speed is improved, but dielectric constant stability becomes more critical
Solution Approach 1:
The patent applies DOPO derivative flame retardant specifically in the epoxy resin matrix used for high-frequency substrates, providing localized flame protection while maintaining the low dielectric constant and high stability required for high-frequency signal transmission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a high-yield, cost-effective production of DOPO derivatives, resulting in electronic materials with improved flame retardancy, low dielectric constants, and high heat resistance suitable for high-frequency substrates, meeting environmental and performance requirements.
Implementation Method 1
a compound (A) is prepared through a dehydration reaction between a compound (B) and a compound (C) for 4-30 hours under the presence of a catalyst
Implementation Method 2
the application of reactive-type organic phosphorus flame retardant, such as a DOPO derivative, is common, where such a flame retardant is linked onto the epoxy resin through covalent bonding
Data Source
AI summary
A composite, a high-frequency circuit substrate using the same and method thereof are discussed. The composite includes the following solid components: a DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative compound of 10-70 wt %, a curing agent of 10-50 wt %, one or more epoxy of 10-90 wt % and an inorganic filling material of 10-40 wt %. The non-halogen low dielectric epoxy composite uses a high-purity DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative as tiny particles dispersing in the composite. The crosslinking yield of the composite is not reduced, while the heat resistance and flame retardancy are increased. The prepreg and copper foil covered laminate for use in printed circuit board, made from the epoxy composite, has great dielectric property and high glass transition temperature (GTT), satisfying the need of high frequency in electronic signal transmission and high speed in data processing of the industry of copper covered printed circuit board.