Circuit Assembly Heat Dissipation via Embedding Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit assemblies with protruding conductive members suffer from heat release capability deterioration due to air layers formed in pits, which hinder the dissipation of heat generated by electronic components.
Innovation Solution
A circuit assembly design featuring a plate-shaped conductive member with protruding portions that include a first and second leg, where a heat-conductive embedding member is placed inside the pit formed by the protruding portion, ensuring intimate contact and enhancing heat dissipation, and a manufacturing method that simultaneously forms the protruding portion and embeds the heat-conductive member using a punch and die process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protruding portion is formed to connect the terminal and conductive member, then reliable electrical connection is achieved, but a pit is formed that traps air and deteriorates heat release capability
Solution Approach 1:
An embedding member is introduced as an intermediary substance to fill the pit formed by the protruding portion. This embedding member has higher heat conductivity than air, serving as a thermal bridge that conducts heat away from the electronic component while allowing the protruding portion to maintain its electrical connection function.
Solution Approach 2:
The heat conductivity parameter of the medium in the pit is changed from air (low heat conductivity) to an embedding member material with higher heat conductivity. This parameter change directly addresses the heat release capability deterioration caused by the air layer in the pit.
2Temperature
If the embedding member is placed in the pit after protruding portion formation, then heat conductivity improvement is achieved, but gaps may form between the embedding member and pit surface reducing effectiveness
Solution Approach 1:
The embedding member is prepared and positioned in advance before the protruding portion is formed. By performing the embedding member placement as a preliminary action, the subsequent protruding portion formation process can press the embedding member into intimate contact with the pit surface, eliminating gaps and ensuring optimal thermal contact.
Solution Approach 2:
The formation of the protruding portion and the positioning of the embedding member are merged into a single integrated process. The protruding portion formation action simultaneously serves to both create the electrical connection and to press the embedding member into place, ensuring intimate contact and eliminating the need for separate positioning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedding member with higher heat conductivity than air effectively suppresses heat release capability deterioration by ensuring no air layer forms between the embedding member and the pit, improving heat dissipation efficiency and simplifying the manufacturing process.
Implementation Method 1
an embedding member having a heat conductivity higher than a heat conductivity of air is provided inside the pit so as to be on a first and a second side by the first and second legs of the conductive member
Data Source
AI summary
Provided is a circuit assembly that can suppress deterioration of its heat releasing capability caused by a pit formed by the formation of a protruding portion that enters an opening formed in a substrate. Provided is a manufacturing method with which such a circuit assembly can be produced easily. A conductive member is provided with a protruding portion that enters an opening formed in a substrate and to which a terminal of an electronic component is connected, a pit formed by formation of the protruding portion is covered by a base member for supporting the conductive member, and an embedding member having a heat conductivity higher than that of air is provided inside the pit.