Modified Cycloolefin Copolymer Resin for High-Frequency PCBs
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Solution Overview
Problem
Current materials for printed circuit boards, such as polyphenylene ether and polyolefin resins, fail to provide adequate low dielectric constant, low dielectric dissipation, and mechanical strength, especially in high-frequency applications, due to fragility and thermal-oxidative aging issues.
Innovation Solution
A thermosetting resin composition incorporating a modified cycloolefin copolymer, formed by reacting maleic anhydride with cycloolefin copolymer, is used to create a laminate with improved dielectric properties, peel strength, and heat resistance, combining excellent dielectric properties with enhanced adhesion and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyphenylene ether resin is used as low dielectric material, then dielectric constant is reduced, but mechanical strength deteriorates due to fragility
Solution Approach 1:
The patent uses a composite resin system comprising polyphenylene ether resin (for low dielectric constant) combined with polybutadiene resin and/or polyisoprene resin (for mechanical strength and flexibility). This composite approach allows the material to simultaneously achieve low dielectric properties and adequate mechanical strength, resolving the contradiction between energy loss reduction and strength maintenance.
2Loss of energy
If polyolefin resin is used to reduce dielectric dissipation, then dielectric properties are improved, but thermal stability deteriorates due to insufficient curing
Solution Approach 1:
The patent modifies the polyolefin resin by introducing reactive functional groups (carboxyl groups with content of 0.01-5 mmol/g) through controlled oxidation or grafting. This parameter change enables the resin to undergo effective curing reactions, transforming it from a thermoplastic with poor thermal stability to a thermosetting or crosslinked system with improved thermal stability and cure completeness, while maintaining low dielectric dissipation properties.
Solution Approach 2:
The patent introduces curing agents or crosslinking promoters as intermediaries that facilitate complete curing of the polyolefin resin. These intermediaries enable the polyolefin to achieve sufficient crosslinking density for thermal stability while preserving its inherent low dielectric dissipation characteristics.
3Ease of manufacture
If conventional resins are used for printed circuit boards, then manufacturing is simple, but high-frequency performance deteriorates due to high dielectric loss
Solution Approach 1:
The patent optimizes specific parameters of the resin system including dielectric constant (3.5-4.5), dielectric dissipation factor (0.005-0.02), and glass transition temperature (80-150°C) to achieve high-frequency performance. By carefully controlling these parameters through resin selection and formulation, the material achieves low dielectric loss suitable for high-frequency applications while maintaining conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified cycloolefin copolymer-based laminate achieves low dielectric constant and dissipation factor, high glass transition temperature, and sufficient peel strength, making it suitable for high-frequency and high-speed communication fields while maintaining good heat resistance and processability.
Implementation Method 1
a modified cycloolefin copolymer, and other unsaturated resins; the modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer
Data Source
AI summary
Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.