Etching Thick Conductive Layers via Machining Recesses
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Solution Overview
Problem
The existing etching processes for forming circuit patterns in thick metal layers require large amounts of chemical solutions and can damage the substrate, particularly due to the machining process which affects the thermally conductive and electrically insulating layer.
Innovation Solution
An etching method involving a thermally conductive and electrically insulating substrate with a non-photosensitive polymer masking layer, where the masking layer and part of the conductive layer are removed by machining to form electrically conductive recesses with predetermined thickness and width ratios, reducing the need for chemical solutions and protecting the underlying substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a traditional etching process is used to form circuit patterns in thick metal layers, then the circuit pattern can be formed, but a large amount of chemical solution is required and the substrate can be damaged
Solution Approach 1:
The patent applies preliminary action by first forming a recess in the thick metal layer through machining before performing the etching process. This pre-formed recess reduces the amount of metal that needs to be removed by chemical etching, thereby reducing chemical solution consumption and minimizing substrate damage. The recess formation is performed as a preparatory step that facilitates the subsequent etching process.
Solution Approach 2:
The patent segments the metal layer removal process into two distinct stages: first, mechanical machining to form a recess and remove part of the metal layer; second, chemical etching to remove the remaining metal. This segmentation allows each process to be optimized independently, with machining handling the bulk removal and etching handling the precise patterning, thereby reducing overall chemical solution usage.
2Quantity of substance
If a machining process is used to remove thick metal layer, then chemical solution usage is reduced, but the machining process can damage the thermally conductive and electrically insulating layer
Solution Approach 1:
The patent forms the recess and removes part of the metal layer through machining as a preliminary action before the etching process. By performing this mechanical removal first, the subsequent etching process requires significantly less chemical solution, thereby reducing the harmful effects of chemical exposure on the substrate while still allowing precise patterning to be achieved.
Solution Approach 2:
The patent uses an intermediary approach by combining mechanical machining and chemical etching in a sequential process. The machining step acts as an intermediary that prepares the metal layer by removing bulk material and forming recesses, thereby reducing the burden on the chemical etching process and minimizing direct chemical exposure to the substrate.
3Reliability
If thick electrically conductive layer is processed, then electrical conductivity is maintained, but the etching process becomes more complex and time-consuming
Solution Approach 1:
The patent segments the processing of thick electrically conductive layers into two stages: first, mechanical machining to form recesses and remove bulk material; second, chemical etching to complete the patterning. This segmentation simplifies the overall process by dividing the complex task of removing thick metal into more manageable steps, each with optimized parameters, thereby reducing total processing time and complexity.
Solution Approach 2:
The patent performs preliminary machining to form recesses in the thick metal layer before etching. This preliminary action reduces the thickness of metal that needs to be removed by chemical etching, thereby simplifying the etching process, reducing processing time, and maintaining electrical conductivity in the remaining patterned areas.
Data Source
AI summary
An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided. The etching method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, an electrically conductive layer, and a non-photosensitive polymer masking layer, removing one part of the non-photosensitive polymer masking layer and one part of the electrically conductive layer by a machining process to form at least one electrically conductive recess having the electrically conductive layer exposed, forming a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, removing a reserved part of the electrically conductive layer between a bottom wall of the electrically conductive recess and a bottom surface of the electrically conductive layer, and removing a remaining part of the non-photosensitive polymer masking layer.