Perforated Mask Alignment for Circuit Board Positioning Accuracy
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Solution Overview
Problem
Conventional methods for producing circuit boards face challenges in achieving precise positioning accuracy due to the need for registration holes, which can be damaged, costly, and require multiple pressing tools for different shapes and sizes of metal foils, leading to variability in positioning accuracy and increased costs.
Innovation Solution
The method involves using perforated shaped parts to form a semi-finished product with a perforated mask, which is aligned and pressed to create a circuit board substrate, eliminating the need to align shaped parts with holes in the metal foil, thereby improving positioning accuracy and reducing costs by using a single set of positioning pins and tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If registration holes are inserted into the metal foil for aligning conductors, then the conductors can be interconnected reliably, but the positioning accuracy varies depending on hole shape and the reception holes are prone to damage and expansion
Solution Approach 1:
The invention extracts the alignment function from the metal foil registration holes and transfers it to separate shaped parts with reception holes. The shaped parts are arranged in a mold to form a perforated mask that serves as the alignment reference, while the metal foil only needs to be positioned relative to these shaped parts. This separation eliminates the need for registration holes in the metal foil itself, preventing damage and expansion issues.
Solution Approach 2:
The shaped parts with reception holes act as an intermediary element between the metal foil and the positioning pins. Instead of directly aligning metal foil holes with positioning pins, the shaped parts serve as a stable reference structure that mediates the alignment process, ensuring consistent positioning accuracy regardless of metal foil variations.
2Adaptability or versatility
If different pressing tools and positioning pins are made available for films of different shapes and sizes, then various metal foils can be processed, but the device complexity and costs increase
Solution Approach 1:
The shaped parts with reception holes are designed to be universally applicable across different metal foil shapes and sizes. The same set of shaped parts forms a perforated mask that can accommodate various positioning pin arrangements, eliminating the need for multiple specialized tooling sets. The mold can be reconfigured to arrange the same shaped parts in different patterns as needed.
Solution Approach 2:
The alignment system is segmented into separate shaped parts that can be independently arranged in the mold. This modular approach allows the same components to be reconfigured for different metal foil dimensions and shapes, providing versatility without requiring complete tooling changes. Each shaped part with its reception hole functions as an independent alignment reference.
3Manufacturing precision
If reception holes are treated carefully to avoid damage or expansion, then positioning accuracy is maintained, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The invention extracts the reception holes from the metal foil and places them in separate shaped parts. These shaped parts are manufactured with precise reception holes that are not subject to the same damage risks as metal foil holes. The shaped parts can be made from more robust materials and manufactured using processes that ensure higher dimensional stability and resistance to damage during handling and pressing.
Data Source
AI summary
A method is provided for producing circuit boards with perforated shaped parts. The perforated shaped parts are arranged and fixed relative to one another in a specified configuration in order to form a semi-finished product with a perforated mask, wherein the semi-finished product is then positioned in a press using the perforated mask and is pressed together with at least one other element in order to form a circuit board substrate for producing a circuit board. A system is also provided for producing circuit boards in order to prepare corresponding semi-finished products and processing same in order to form a circuit board substrate for producing a circuit board.