Laminated Wiring Substrate With Segmented Via Conductors
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Solution Overview
Problem
Existing wiring substrates face challenges in achieving high-density, fine-wiring configurations with minimal inter-wiring distances and widths, leading to inefficiencies in signal transmission and circuit design flexibility.
Innovation Solution
A laminated wiring substrate structure comprising a first build-up part with fine, high-density conductor layers and via conductors, and a second build-up part with thicker conductor layers, where the first build-up part's conductor layers and via conductors have a specific layered structure with a first layer covering the inner wall of via openings, featuring a first portion closer to the center than a second portion, enhancing adhesion and reducing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the minimum wiring width and inter-wiring distance are reduced to increase wiring density, then the wiring capacity and design flexibility are improved, but the signal transmission quality deteriorates due to increased interference and reduced adhesion
Solution Approach 1:
The via conductor is segmented into a first layer and a second layer, where the first layer forms an inner wall coating and the second layer forms an outer filling material. This segmentation allows the inner wall to provide adhesion and signal integrity while the outer material provides structural support, enabling fine wiring without compromising transmission quality
Solution Approach 2:
Different portions of the via conductor have different properties: the first layer has high adhesion to the insulating layer to ensure signal integrity, while the second layer provides structural support. This local differentiation of properties allows the via conductor to simultaneously maintain signal quality and enable dense wiring configurations
2Quantity of substance
If the conductor layers are made thinner to reduce wiring width, then the wiring density is improved, but the adhesion strength and electrical connectivity deteriorate
Solution Approach 1:
The via conductor is divided into a first layer that coats the inner wall surface and a second layer that fills the remaining space. The first layer is specifically designed to provide strong adhesion to the insulating layer, ensuring reliable electrical connectivity even when overall conductor dimensions are reduced for higher density
Solution Approach 2:
The via conductor uses a composite structure with two different materials or material configurations: the first layer material is selected for optimal adhesion to the insulating layer, while the second layer material provides structural integrity. This composite approach maintains strength while enabling thinner overall conductor dimensions
Data Source
AI summary
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.