Modular Electronic Architecture for Phased Array Antennas
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Solution Overview
Problem
Conventional electronic circuit board designs for phased array antennas face challenges in supporting multiple beams and high-frequency operations due to size constraints and complexity, making it difficult to expand or integrate additional circuitry effectively.
Innovation Solution
A modular electronic architecture that allows identical or similar circuit elements to be interconnected, enabling the expansion of supported functions by adding more elements or boards, and allowing circuitry to be contained within a defined area, with each element processing or passing signals to others while maintaining compactness and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are interconnected on a common printed circuit board to implement complex circuits, then the circuit functionality is improved, but the board area and design complexity increase significantly
Solution Approach 1:
The patent divides the complex circuit board into multiple modular circuit assemblies, each containing specific electronic components and interconnections. These assemblies can be independently designed, manufactured, and tested, then integrated together to form the complete circuit system, thereby reducing individual board complexity while maintaining overall functionality
Solution Approach 2:
The patent transitions from a two-dimensional layout on a single circuit board to a three-dimensional stacked architecture where multiple circuit assemblies are vertically interconnected. This allows complex circuits to be distributed across multiple layers/assemblies, reducing the area required on any single board while maintaining full circuit functionality
2Adaptability or versatility
If a large number of components are interconnected on a printed circuit board, then the circuit capabilities are enhanced, but the board area becomes quite large
Solution Approach 1:
The patent segments the large number of components into multiple circuit assemblies distributed across stacked boards. Each assembly contains a manageable subset of components, allowing the system to achieve high circuit capabilities without requiring any single board to be excessively large
Solution Approach 2:
The patent implements a nested structure where multiple circuit assemblies are stacked and interconnected vertically, similar to nested dolls. This three-dimensional arrangement allows numerous components to be integrated within a compact footprint by utilizing vertical space rather than expanding horizontal board area
3Adaptability or versatility
If the area for beam forming networks is expanded into three dimensions using additional circuit boards, then the number of controllable beams is increased, but the design difficulty and complexity of each board increases
Solution Approach 1:
The patent segments the beam forming network functionality across multiple standardized circuit assemblies that can be stacked vertically. Each assembly provides a portion of the beam forming capability, and identical or similar assemblies can be replicated and stacked to increase the number of controllable beams without increasing the complexity of any individual board
Solution Approach 2:
The patent employs universal, identical or similar circuit assemblies that can perform the same functions across different positions in the stack. This multi-functionality allows the system to scale the number of controllable beams by simply adding more of the same standardized assembly, rather than designing increasingly complex individual boards
Data Source
AI summary
A modular electronic architecture according to which electrical components are distributed across substantially identical, interconnected circuit elements or assemblies is provided. Scaling of the electronic device can be achieved by selecting different numbers of circuit elements. Embodiments of the present invention may also provide for a compact assembly, formed from interconnection of separate circuit boards in a stack. Particular applications include the provision of beam forming networks in connection with phased array antennas in which the beam forming networks are formed on circuit boards having an area that is about the same size as the area of a circuit board on which the antenna elements are formed.