Embedded Component Cluster with Uncured Resin for Heat Management
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Solution Overview
Problem
The increasing miniaturization and functionality of component carriers with multiple electronic components pose challenges in efficiently embedding components while maintaining mechanical robustness and effective heat removal.
Innovation Solution
A cluster configuration is introduced, comprising one or more components encapsulated in uncured solid resin, which can be handled as a single piece and embedded in a recess of a component carrier. The resin is transformed into a flowable state and then cured to permanently fix the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are miniaturized and densely packed to increase functionality, then the number of electronic components and their functionalities increase, but heat removal becomes increasingly difficult and mechanical robustness deteriorates
Solution Approach 1:
The patent segments the embedding process into two distinct phases: first embedding components in uncured solid resin to form clusters, then embedding these clusters in the component carrier. This segmentation allows heat management considerations to be addressed at both the component level (through cluster formation with resin gaps) and the carrier level (through overall resin distribution), resolving the heat removal challenge while maintaining high functionality.
Solution Approach 2:
The uncured solid resin acts as an intermediary material that can be transformed into a flowable state. This intermediary state enables the resin to fill gaps and voids between miniaturized components during embedding, providing thermal pathways for heat removal while maintaining mechanical integrity. The resin's ability to transition between solid and flowable states mediates between the conflicting requirements of dense packing and heat management.
2Manufacturing precision
If components are embedded individually in component carriers, then each component can be positioned precisely, but the embedding process becomes complex and time-consuming
Solution Approach 1:
The patent merges multiple components into clusters by embedding them together in uncured solid resin before inserting the clusters into the component carrier. This merging reduces the number of separate embedding operations required, simplifying the overall process while maintaining precise positioning through the cluster formation stage. The resin encapsulation ensures components remain in their intended positions during handling and embedding.
Solution Approach 2:
The patent performs preliminary embedding of components in uncured solid resin to form complete clusters before the final embedding step in the component carrier. This preliminary action allows components to be positioned and secured within their clusters in advance, reducing the complexity of the final embedding process while preserving positioning precision through the two-stage approach.
3Reliability
If mounting devices are made mechanically robust to operate under harsh conditions, then operational reliability improves, but the embedding process becomes more difficult
Solution Approach 1:
The patent changes the physical state parameter of the resin from solid to flowable during the embedding process. This parameter change allows the resin to flow into gaps and accommodate components easily during manufacturing, simplifying the embedding process. After embedding, the resin cures to provide the mechanical robustness needed for reliable operation under harsh conditions, thus resolving the contradiction between ease of manufacture and operational reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the embedding process, ensures high mechanical integrity, and effectively fills the recess with resin, addressing the challenges of component miniaturization and heat management.
Implementation Method 1
transforming the uncured solid resin into a flowable state so that the transformed resin interacts with the stack by the flowing resin, and thereafter further transforming the transformed resin into a cured solid state
Data Source
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AI summary
A cluster (100) configured to be inserted and subsequently embedded in a recess (116) provided in a component carrier (104), said cluster comprising at least one component (102), and an uncured solid resin (106) encapsulating said component (102), said uncured solid resin (106), or said at least one component (102) and said uncured solid resin (106), forming the exterior surface of said cluster (100).