Backlight Source PCB with Integrated Heat Dissipation
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Solution Overview
Problem
The existing side-in liquid crystal display backlight sources face challenges in reducing thickness due to the presence of a heatsink, which limits heat dissipation when the heatsink is removed.
Innovation Solution
A backlight source design featuring a PCB with a light bar area and a heat dissipating area arranged perpendicularly, where the conductive layer is divided into insulated first and second conductive areas, allowing for effective heat dissipation without a heatsink, utilizing an aluminum base layer and copper conductive layers, and incorporating an open slot for insulation and test points to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is used for heat dissipation, then heat dissipation capability is improved, but the thickness of the backlight source increases
Solution Approach 1:
The patent combines the heatsink function with the PCB structure by integrating heat dissipation fins directly into the PCB body, creating a unified component that performs both circuit board and heat dissipation functions simultaneously, thereby eliminating the need for a separate heatsink assembly
Solution Approach 2:
The PCB is designed to serve multiple functions: it acts as both the circuit board for mounting LEDs and as a heat dissipation device through integrated fins, allowing one component to fulfill multiple roles and reduce overall assembly thickness
2Length of stationary object
If the heatsink is removed to reduce thickness, then the thickness of the backlight source is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The heatsink functionality is merged into the PCB structure itself through integrated fins, eliminating the need for a separate heatsink component while maintaining heat dissipation capability, thus reducing overall thickness without sacrificing thermal performance
3Reliability
If the conductive layer is divided into insulated areas, then electrical insulation between light bar area and heat dissipating area is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive layer is segmented into distinct insulated areas using slot structures, physically separating the light bar area and heat dissipating area conductive paths to prevent electrical short circuits while maintaining functional integrity
Solution Approach 2:
Slot structures are introduced as intermediary elements between conductive areas to provide electrical insulation, acting as mediators that prevent direct electrical contact between adjacent conductive regions while allowing thermal and mechanical continuity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities, enabling a significant reduction in the overall thickness of the backlight source while maintaining effective cooling, thus addressing the heat dissipation issues without the need for a heatsink.
Implementation Method 1
the base layer is an aluminum base layer, and both the first conductive area and the second conductive area are a copper layer
Data Source
AI summary
Disclosed are a backlight source and a manufacturing method thereof, wherein the method of manufacturing the backlight source comprises the following steps: forming a base layer, a dielectric layer, and a conductive layer stacked successively from bottom to top to form a semi-finished PCB; the semi-finished PCB is divided into a light bar area and a heat dissipating area; the conductive layer is divided into a first conductive area and a second conductive area insulated from each other; etching the second conductive area to form a preset conductive circuit; spraying insulating paint upon the conductive layer to form the insulating layer, thus producing the PCB; and installing the LED onto the light bar area and making it in electrical connection with the second conductive area.