Circuit Bendability/Stretchability TRIZ Cases

A printed circuit board design places a conductive ground layer between an upper wiring trace and a support substrate to shield electromagnetic waves.

Integrating ultrathin metal films within flex PCB stacks absorbs tension forces, preventing trace failure during repeated bending.

A wiring circuit board uses a metal support layer in the circuit region and a thinner insulating layer in the mounting region to enable rear-side element attachment.

Segmented protection layers and inclination parts prevent cracking during bending, resolving reliability versus strength trade-offs.

An antenna substrate with a high dielectric constant second insulating layer reduces thickness and yield issues caused by conventional mold processes.

Laser ablation removes insulation from conductive yarns before interposer placement, reducing alignment errors and preserving textile flexibility.

Segmented gaps in a fixture support rigid and flexible PCB sections, preventing damage to vulnerable areas during handling.

A printed circuit board with a deformation zone electrically connects LED and driver regions.

Simultaneous attachment of offset layers creates a liquid-tight seal that protects the electrical component from moisture damage.

Pillar-aligned conductive particles within a flexible line reduce resistance variation and prevent cracking under tensile strain.

A modular wearable device system uses interchangeable functional modules and flexible wire assemblies to create customizable on-skin interfaces.

Metal deformation prevention members increase rigidity on flexible circuit boards to maintain structural integrity during assembly.

An intermediary layer with graded stiffness absorbs mechanical stress between rigid circuits and flexible textiles to prevent wiring disconnection.

Adhesion patterns on flexible circuit boards increase local stiffness to prevent edge drooping, ensuring precise pad alignment during assembly.

Elevating the antenna structure via a protruding support reduces dielectric losses and improves radiation efficiency.

Laminating a printed planar foil onto elastomer substrates resolves printing quality issues on rough, non-planar surfaces without adding adhesion layers.

Segmented substrates with compensation circuits correct driving current variations during stretching to resolve luminance irregularities.

Segmented redundant traces maintain operation after fracture, preventing failure from repeated flexure.

Segmented conductive patterns with gaps and cut features allow a flexible circuit board to elongate during repeated folding, preventing layer cracking.

Magnetic components press contact pads together to resolve bulk and damage trade-offs in high-density neural interfaces.