Sealed Layer Device Preventing Liquid Ingress

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Solution Overview

Problem

Electronic devices often fail to meet specifications in terms of dimensions, flexibility, robustness, and liquid-tightness due to complex manufacturing processes involving multiple stages and different components, leading to issues such as bulkiness, lack of robustness, and insufficient liquid-tightness.

Innovation Solution

A method and device where two layers with an electrical component positioned between them are attached to create a sealed portion, preventing liquid ingress and allowing electrical communication, with the layers being offset to expose the electrical connection for power supply, and optionally including adhesive or shape-adaptable materials for flexibility and specific shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple manufacturing stages and different components are used to construct electronic devices, then device functionality and integration are improved, but liquid-tightness and robustness deteriorate

Engineering Contradiction:

Improvedevice functionalityVSAvoidliquid-tightness

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent combines multiple components (first layer, second layer, electrical component, adhesive layer) into a single integrated sealed structure through simultaneous attachment, creating a unified liquid-tight assembly that maintains functionality while ensuring robustness

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical component is positioned between the first and second layers, with the adhesive layer bonding these layers together to form a nested, sealed structure that protects internal components while maintaining device functionality

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple manufacturing stages and different components are used to construct electronic devices, then device functionality is improved, but device robustness deteriorates

Engineering Contradiction:

Improvedevice functionalityVSAvoiddevice robustness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent merges multiple components into a single integrated structure through simultaneous attachment, creating a robust unified assembly that maintains structural strength while preserving device functionality

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The device uses composite construction with different materials (adhesive layer, first layer, second layer) bonded together to form a structurally robust assembly that maintains both strength and functionality

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If components are manufactured at different sites and using different processes, then manufacturing flexibility is improved, but manufacturing precision deteriorates

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoiddimensional specification

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The electrical component is positioned on one layer before attachment, and the adhesive layer is applied in advance, allowing components from different manufacturing sites to be integrated with precise positioning in a subsequent simultaneous attachment process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive layer acts as an intermediary that bonds the first and second layers together with precise alignment, enabling components manufactured at different sites to be assembled with high dimensional accuracy

Inventive Principle:

Principle #24Intermediary (Mediator)

4Adaptability or versatility

If traditional multi-stage manufacturing is used, then component integration is improved, but device complexity increases

Engineering Contradiction:

Improvecomponent integrationVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple manufacturing steps into a single simultaneous attachment process, reducing manufacturing process complexity while maintaining effective integration of all components into a unified structure

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12101887B2Preventing liquid ingress in a device

Publication Date: 2024.09.24 KONINKLIJKE PHILIPS NV

AI summary

In an embodiment, a method of manufacturing (100) is described. The method comprises providing (102) a first layer defining a first inner surface (203a) and a first outer surface (203b), a second layer defining a second inner surface (205a) and a second outer surface (205b), and an electrical component (206) positioned on the first inner surface or the second inner surface. The method further comprises attaching (104) the first and second layers together to create a device (200) comprising the first and second layers, wherein the first outer surface and the second outer surface define an external surface of the device. The device further comprises a sealed portion (208) defined by liquid-tight attachment between the first and second inner surfaces. In use of the device, the sealed portion prevents liquid ingress into the device between the first and second layers towards the electrical component.