Flexible Circuit Board Conductive Patterns for Deformation Reliability
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Solution Overview
Problem
Flexible electronic devices with touch sensing functions face reliability issues due to conductive layer damage from repeated deformation, such as folding or rolling, which affects the precision and durability of touch recognition.
Innovation Solution
A flexible circuit board design featuring conductive patterns with gaps and cut patterns that allow for elongation and compression without damaging the conductive layer, incorporating substrate cut patterns to enhance elasticity and prevent stripping or cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit board is designed with continuous conductive layers to ensure electrical connectivity, then electrical conductivity is improved, but the conductive layer becomes vulnerable to stripping and cracking during repeated deformation
Solution Approach 1:
The conductive pattern is divided into multiple segments by introducing gaps and cut patterns. The conductive layer is segmented into main body portions and extended portions that can move independently, preventing continuous stress accumulation and crack propagation while maintaining electrical connectivity through the gaps.
Solution Approach 2:
The conductive pattern is designed with dynamic characteristics through gaps and cut patterns that allow the conductive layer to adapt its shape during deformation. The extended portions can elongate or compress relative to the main body, enabling the conductive layer to accommodate repeated folding and rolling without damage.
2Adaptability or versatility
If the flexible circuit board is made more elastic to accommodate repeated folding and rolling, then adaptability to deformation is improved, but the structural integrity and precision of conductive patterns may be compromised
Solution Approach 1:
The circuit board structure is segmented into rigid conductive pattern regions and flexible substrate regions. The gaps and cut patterns create discrete segments that allow controlled deformation in specific areas while maintaining precision in the conductive pattern regions, enabling the board to withstand repeated deformation without compromising manufacturing precision.
3Reliability
If the conductive layer is made thicker to prevent cracking and improve durability, then reliability during deformation is improved, but the flexibility and ease of folding of the circuit board deteriorates
Solution Approach 1:
Instead of increasing the thickness of the entire conductive layer, the invention segments the conductive pattern into multiple regions with gaps and cut patterns. This allows the conductive layer to maintain its original thin profile for flexibility while the segmented structure prevents crack propagation, achieving durability without sacrificing flexibility.
Data Source
AI summary
A circuit board includes a substrate and conductive patterns disposed inside or on the substrate, in which two neighboring conductive patterns are separated from each other by a gap disposed therebetween, and the conductive pattern includes first cut patterns connected to the gap and disposed toward an inside of the conductive pattern.