Wiring Circuit Board With Segmented Support And Mounting Regions
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Solution Overview
Problem
Conventional wiring boards for mounting lack sufficient strength and flexibility to accommodate electronic elements mounted from the rear side, and they do not allow for efficient electrical connection of image elements from the opposite side of the terminal region.
Innovation Solution
A wiring circuit board design featuring a circuit region with a metal support layer for enhanced strength and a mounting region with a thinner base insulating layer and conductive layer, allowing electronic elements to be mounted from the opposite side through an opening in the base insulating layer, with the terminal exposed for reliable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal support layer is added to enhance the strength of the wiring board, then the strength of the circuit region is improved, but the thickness of the board increases and mounting from the rear side becomes difficult
Solution Approach 1:
The wiring board is divided into a circuit region containing the metal support layer for strength, and a mounting region without the metal support layer for ease of rear-side mounting. This spatial segmentation allows each region to have optimized properties for its specific function.
Solution Approach 2:
The metal support layer is selectively disposed only in the circuit region, providing local reinforcement where structural strength is needed, while the mounting region remains free of this layer to allow electronic elements to be mounted from the rear side. This local differentiation resolves the contradiction between overall strength and rear-side mountability.
2Ease of operation
If the base insulating layer is made thinner to reduce overall thickness and facilitate rear-side mounting, then the ease of mounting from rear side is improved, but the insulating performance and structural integrity may deteriorate
Solution Approach 1:
The base insulating layer is segmented into different thicknesses: a first thickness in the circuit region providing adequate insulation and structural support, and a second, smaller thickness in the mounting region facilitating rear-side mounting. This segmentation allows the mounting region to be thin for ease of operation while the circuit region maintains sufficient thickness for reliability.
Solution Approach 2:
The base insulating layer has locally differentiated thickness properties: thinner in the mounting region where rear-side access is needed, and thicker in the circuit region where insulating performance and structural integrity are critical. This local quality variation resolves the contradiction between mountability and insulating performance.
3Ease of operation
If the conductive layer is made thinner to reduce thickness for rear-side mounting, then the ease of mounting from rear side is improved, but the electrical conductivity and current carrying capacity may deteriorate
Solution Approach 1:
The conductive layer is segmented with different thicknesses: a first thickness in the circuit region ensuring adequate electrical conductivity and current carrying capacity, and a second, smaller thickness in the mounting region enabling rear-side mounting of electronic elements. This segmentation allows each region to have optimized thickness for its specific function.
Solution Approach 2:
The conductive layer exhibits local quality variation in thickness: thicker in the circuit region where high electrical conductivity is required, and thinner in the mounting region where reduced thickness facilitates rear-side mounting while still providing sufficient electrical connection to terminals. This local differentiation resolves the contradiction between electrical performance and mountability.
Data Source
AI summary
A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.