Backlight Module Reflection Plate Warping Prevention

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Solution Overview

Problem

Current backlight modules suffer from optical defects such as wrinkles and Newton rings due to warping of the reflection plate, caused by stress from inconsistency in flatness between the heat sinking film and reflection plate, exacerbated by temperature changes and increased power consumption.

Innovation Solution

A backlight module design featuring a heat sinking plate and reflection plate that are not directly bonded, with the reflection plate positioned within a mold frame to allow movement and reduce stress, forming a box-shaped structure that reduces thickness and prevents warping, using materials like natural graphite or copper foil for effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the heat sinking plate and reflection plate are directly bonded, then the structural stability is improved, but the reflection plate warping occurs due to thermal expansion inconsistency

Engineering Contradiction:
Improvestructural stabilityVSAvoidreflection plate flatness
Core Design Contradiction:
Stability of the object's compositionVSShape

Solution Approach 1:

The patent divides the bonding structure into segments: the heat sinking plate is bonded to the mold frame, while the reflection plate is positioned on the heat sinking plate without direct bonding between them. This segmentation allows independent thermal expansion of each component, preventing warping while maintaining structural stability through the mold frame's support.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat sinking plate acts as an intermediary element between the mold frame and the reflection plate. It provides thermal management and mechanical support to the reflection plate without direct bonding, allowing the reflection plate to maintain its flatness while the heat sinking plate absorbs thermal stresses.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If adhesive is used to fix the reflection plate to the heat sinking plate, then the positional stability is improved, but the warping and optical defects are exacerbated

Engineering Contradiction:
Improvepositional stabilityVSAvoidoptical defects
Core Design Contradiction:
Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the adhesive bonding between the heat sinking plate and reflection plate, eliminating the source of stress that causes warping. The reflection plate is held in position by the mold frame structure and its own weight, without adhesive bonding to the heat sinking plate, thereby preventing optical defects like wrinkles and Newton rings.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If the backlight module uses traditional bonding structure, then the manufacturing simplicity is maintained, but the module thickness increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmodule thickness
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent introduces a dynamic positioning system where the reflection plate can move relative to the heat sinking plate within the mold frame. This dynamic structure eliminates the need for thick adhesive layers while maintaining positional stability during assembly, reducing overall module thickness without compromising manufacturing simplicity.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design alleviates warping and optical defects, reduces module thickness, and enhances heat dissipation, resulting in a lighter and thinner backlight module.

Implementation Method 1

the heat sinking plate may be made of natural graphite, synthetic graphite, copper foil, aluminum foil or a thermally conductive silicone film

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11294229B2Backlight module and display device
Publication Date: 2022.04.05 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US11294229B2 patent drawing
  • US11294229B2 patent drawing

AI summary

The present disclosure relates to a backlight module and a display device. The backlight module includes: a heat sinking plate; a mold frame fixed to the heat sinking plate and surrounding a region on the heat sinking plate; and a reflection plate disposed in the region surrounded by the mold frame such that the reflection plate can be moved relative to the heat sinking plate.