Lighting Heating/Cooling Arrangements TRIZ Cases

A luminaire establishes a continuous thermal pathway from the light engine to the can, lowering junction temperature.

A multilayered fluorescent wafer uses a metal reflective film and silver paste to boost luminous efficiency.

Silver particles in the encapsulating material conduct heat away from the LED, reducing phosphor thermal degradation and enabling higher operating currents.

A lower heat dissipating structure uses planar elements with varying cross-sectional extensions to manage thermal loads in LED lighting devices.

Excess liquid immersion material enables continuous convection cooling while index matching minimizes refractive losses at interfaces.

A light source device integrates a high conductivity heat conductive member between the fluorescent body and the light condensing member.

Unitary chassis with interchangeable modules integrates air vents and lights, eliminating gap sealing to reduce weight and installation complexity.

A deformable heat transfer component conducts thermal energy from a lighting device casing directly to a fixture housing.

An optical light guide directs LED radiation to a vehicle cover, removing ice without reducing radar signal permeability.

Capillary protrusions in the heat sink vaporize cooling medium to prevent localized heat buildup and improve temperature uniformity.

Interference fit buckle units join the bulb shell and head without glue, reducing manufacturing complexity while maintaining connection strength.

Segmenting the inner space and adding a socket coupling portion reduces light leakage while maintaining LED chip protection.

A heat sink on the luminescent element removes thermal energy from densely packed LEDs, maintaining optical performance.

A socket uses conductive silicone rubber to mount light tubes and provide electrical connections.

An L-shaped heat dissipation element moves relative to the backplane via a sliding connector, preventing light guide plate deformation from thermal expansion.

A backlight module design uses a movable reflection plate within a mold frame to reduce stress and optical defects.

Staggered hollow fins disrupt thermal boundary layers to reduce thermal resistance in LED illumination apparatuses.

Segmented blowers target upper and lower lamp surfaces to resolve uneven temperature distribution across varying projector orientations.

Integrating a thermal fluid channel into the rotating cylindrical body reduces lateral space while maintaining effective heat dissipation.

An elevated chip design prevents cavity light capture and molding breakage while improving extraction efficiency.

A lighting element uses materials with different expansion coefficients to change shape when exposed to heat or light.

A single driver provides ripple-free constant current to multiple high-powered LEDs using a digital controller and ASIC.

A heat dissipation structure uses separate channels to maintain distinct target temperatures for multiple electronic components.

A concave neodymium-doped glass bulb absorbs yellow wavelengths to modify the spectral output of an LED lamp assembly.

A projection device uses rotating irregular plano-convex lenses to generate dynamic visual effects.

Integral rear frame hooks secure heat sinks to backlit displays, eliminating nuts and bolts that increase assembly complexity.

A diffraction lens array splits light beams to prevent energy concentration on the phosphor layer, reducing thermal load while maintaining high output.

A lightweight enclosure houses intumescent material that expands upon heat exposure to form a thermal barrier around recessed lighting fixtures.

Heating active materials releases hydrogen to improve thermal dissipation while preventing hazardous pressure buildup.

Segmenting the cooling plate reduces pressure loss in the flow path, enabling effective heat transfer without requiring a large pump.

Separate heat sinks with air gaps isolate thermal subsystems to control junction temperatures across red, green, and blue LEDs.

Detecting lamp voltage variations allows the system to adjust the cooling fan speed, maintaining optimal temperature and brightness as the device ages.

Spacing the luminescent element reduces backscatter and self-absorption, resolving energy loss trade-offs in LED packages.

Thermoelectric cooling condenses chamber moisture while heat conduction vaporizes condensate, preventing optical degradation.

Integrated light source panel reduces part count to resolve the contradiction between thin downlight thickness and high assembly complexity.

Segmented thermal mount eliminates heavy obstructing tubes, improving heat dissipation and light directionality.

Separating the wavelength converting element from the LED via side-mounted heat sinks eliminates bonding stress and improves extraction efficiency.

An insulating layer between the baseboard and light guide plate blocks heat transmission, preventing optical deformation.

Dual rotational structures enable precise directional control of the lighting apparatus while maintaining illumination intensity and quality.

A laser light source device cools the reflection and diffusion member to prevent heat breaking from high-output laser light exposure.

Sealed thermal conduction removes waste heat from visualization components while preventing dust ingress and electrical failures.

Channel constriction compresses these vortices against the wall, expelling high-velocity air outward while preventing recirculation.

Radial heat dissipating plates conduct thermal energy away from a rotating luminescent wheel, reducing temperature and extending material lifespan.

Replacing the lens plate adjusts beam characteristics while the metal cup conducts heat from the LED plate to reduce manufacturing complexity.

Segmented substrate zones separate air vents from thermal paths, reducing local temperature rise without increasing system size.

A backlight module uses a thermoelectric device group to actively pump heat away from the lamp plate.

Embedding quantum dots with varied sizes in a matrix material enables precise tuning of the emission spectrum, resolving broad phosphor limitations.

Extending pin fins radially beyond the base plate diameter allows luminaires to sit closer together while preventing fin contact during tilting and rotation.

Elongated thermal conductive elements extend through the substrate to dissipate heat from LEDs, resolving reliability issues in densely packed configurations.