Lighting Heating/Cooling Arrangements TRIZ Cases
- Luminaire Thermal Pathway Reducing LED Junction Temperature
A luminaire establishes a continuous thermal pathway from the light engine to the can, lowering junction temperature.
- Multilayered Fluorescent Wafer Thermal Management
A multilayered fluorescent wafer uses a metal reflective film and silver paste to boost luminous efficiency.
- Thermally Conductive LED Encapsulant for Heat Management
Silver particles in the encapsulating material conduct heat away from the LED, reducing phosphor thermal degradation and enabling higher operating currents.
- LED Lighting Device with Variable Cross-Section Heat Sink
A lower heat dissipating structure uses planar elements with varying cross-sectional extensions to manage thermal loads in LED lighting devices.
- Phosphor Assembly Liquid Immersion Cooling and Index Matching
Excess liquid immersion material enables continuous convection cooling while index matching minimizes refractive losses at interfaces.
- Light Source Device Heat Conductive Member Thermal Management
A light source device integrates a high conductivity heat conductive member between the fluorescent body and the light condensing member.
- Aircraft PSU Unitary Chassis Modular Integration
Unitary chassis with interchangeable modules integrates air vents and lights, eliminating gap sealing to reduce weight and installation complexity.
- Heat Transfer Component for LED Thermal Management
A deformable heat transfer component conducts thermal energy from a lighting device casing directly to a fixture housing.
- Vehicle Cover Heating via Optical Light Guide
An optical light guide directs LED radiation to a vehicle cover, removing ice without reducing radar signal permeability.
- Heat Sink With Capillary Protrusions For LED Cooling
Capillary protrusions in the heat sink vaporize cooling medium to prevent localized heat buildup and improve temperature uniformity.
- Light Bulb Assembly via Interference Fit Buckle Units
Interference fit buckle units join the bulb shell and head without glue, reducing manufacturing complexity while maintaining connection strength.
- LED Package Socket Coupling for Projection Optical Engines
Segmenting the inner space and adding a socket coupling portion reduces light leakage while maintaining LED chip protection.
- Light Guide Luminescent Element Heat Sink Thermal Management
A heat sink on the luminescent element removes thermal energy from densely packed LEDs, maintaining optical performance.
- Conductive Silicone Rubber Socket for Light Tube Mounting
A socket uses conductive silicone rubber to mount light tubes and provide electrical connections.
- Backlight Module Heat Dissipation Element for LCD Thermal Management
An L-shaped heat dissipation element moves relative to the backplane via a sliding connector, preventing light guide plate deformation from thermal expansion.
- Backlight Module Reflection Plate Warping Prevention
A backlight module design uses a movable reflection plate within a mold frame to reduce stress and optical defects.
- Staggered Hollow Fins for LED Heat Dissipation
Staggered hollow fins disrupt thermal boundary layers to reduce thermal resistance in LED illumination apparatuses.
- Dual-Blower Cooling System for Projector Lamp Temperature Uniformity
Segmented blowers target upper and lower lamp surfaces to resolve uneven temperature distribution across varying projector orientations.