Elongated Thermal Conductive Elements for LED Heat Dissipation
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Solution Overview
Problem
Solid state light emitting apparatus, such as LEDs, generate substantial heat during operation, which degrades device performance and reliability, especially when mounted in closely spaced or enclosed configurations, where conventional thermal management techniques are ineffective.
Innovation Solution
The use of elongated thermally conductive elements attached to the LEDs, extending through holes or recesses in the substrate, and connected to a thermal dissipation structure, such as a housing, to efficiently dissipate heat generated by the LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple LEDs are mounted in closely spaced configurations to increase light output, then productivity and light output are improved, but heat dissipation becomes insufficient and device reliability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending thermally conductive elements vertically through the substrate. The elongated thermally conductive elements project beyond the substrate surface, creating additional heat dissipation surfaces in the vertical dimension, which enables effective thermal management in densely packed LED configurations.
Solution Approach 2:
The patent introduces elongated thermally conductive elements as intermediary structures between the LED heat sources and the external environment. These elements serve as thermal conduits that efficiently transfer heat from the LED mounting surfaces through the substrate to external heat dissipation surfaces, mediating the thermal management process.
2Temperature
If conventional heat sinks and thermally conductive media are used for thermal management, then heat dissipation is improved, but the techniques are ineffective in enclosed spaces with limited heat escape paths
Solution Approach 1:
The patent overcomes the limitation of enclosed spaces by extending heat dissipation into the vertical dimension. The elongated thermally conductive elements project beyond the substrate surface, creating heat dissipation surfaces that extend into the third dimension, thereby providing effective thermal management even when horizontal heat escape paths are limited.
3Temperature
If LEDs are mounted on thermally conductive media to manage heat, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the substrate and heat dissipation functions into a unified structure. The elongated thermally conductive elements are integrated with the substrate, combining the mechanical support function of the substrate with the thermal management function, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively transfers heat away from the LEDs, maintaining their performance and reliability, even in densely packed or enclosed lighting applications, by providing enhanced thermal management.
Implementation Method 1
multiple elongated thermally conductive elements each having a proximal end attached proximate to the solid state lighting elements and a distal end attached to a housing, wherein the housing is configured to dissipate thermal energy that is conducted from the solid state light emitting elements via the elongated thermally conductive elements
Data Source
AI summary
Provided are light emitting apparatus including a solid state light emitting element having a first side and a second side, the solid state light emitting element configured to emit light from the first side. Such apparatus further include an elongated thermally conductive element positioned to conduct thermal energy from the second side of the solid state light emitting element.