LED Package Socket Coupling for Projection Optical Engines
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Solution Overview
Problem
Conventional LED packages for projection systems face difficulties in attachment to optical engines due to lack of a socket coupling structure, resulting in poor connections and light leakage, which reduces optical efficiency.
Innovation Solution
The LED package features a package body with an open upper portion, a socket coupling portion for secure attachment to the optical engine, and a non-reflective glass lens to enhance light emission and reduce optical loss, instead of using a molding material that fills the entire inner space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire inner space is filled with molding material, then the LED chip is protected, but light propagation efficiency is reduced and optical loss increases
Solution Approach 1:
The inner space is segmented into two regions: a first inner space filled with molding material for protecting the LED chip, and a second inner space left empty for efficient light propagation. This segmentation allows the patent to simultaneously achieve chip protection and reduced optical loss by assigning different functions to different spatial zones.
2Ease of manufacture
If the package body has a simple quadrangular shape, then manufacturing is simple, but attachment to the optical engine is difficult and connection is poor
Solution Approach 1:
The package body is segmented by adding a protrusion that divides the upper surface into a first upper surface and a second upper surface. The protrusion itself forms a socket coupling portion that enables secure attachment to the optical engine, while the rest of the package body maintains its simple quadrangular shape for ease of manufacture.
Solution Approach 2:
The socket coupling portion acts as an intermediary structure that mediates between the simple package body and the optical engine socket. It provides the necessary coupling interface for secure attachment while maintaining the simplicity of the overall package body design.
3Reliability
If molding material fills the entire inner space, then the LED chip is fully protected, but light leakage occurs through openings between the package and socket
Solution Approach 1:
The inner space is divided into a first inner space (filled with molding material for chip protection) and a second inner space (empty for light propagation). This segmentation prevents light from traveling through large amounts of molding material, thereby reducing light leakage while maintaining chip protection.
Solution Approach 2:
The molding material is extracted from the second inner space, leaving it empty. This removal eliminates the source of optical loss and light leakage that would occur if molding material filled the entire light propagation path, while the first inner space retains molding material for chip protection.
Data Source
AI summary
A light emitting diode (LED) package for a projection system is provided, which includes a package body having an inner space formed therein and having an open upper portion; and an LED chip mounted onto a bottom of the package body, wherein the package body includes a socket coupling portion formed around the upper portion of the package body to have a certain corresponding thickness and height allowing the socket coupling portion to be inserted into the socket of the optical engine.