Multilayered Fluorescent Wafer Thermal Management

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Solution Overview

Problem

Existing laser lighting and display technologies face challenges with low luminous efficiency, difficult thermal dissipation, and low fluorescence saturation threshold due to the limitations of traditional organic encapsulation materials and fluorescent glass with low thermal conductivity.

Innovation Solution

A multilayer-structured fluorescent wafer is developed, comprising a fluorescent glass layer, a metal reflective film layer, a sealing silver paste layer, and a metal substrate layer. This configuration enhances luminous efficiency through reflective optimization and improves thermal conductivity and heat dissipation using high-purity silver paste and a metal substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional organic encapsulation materials (epoxy resins, organic silicone) are used for fluorescent conversion in laser lighting, then good plasticity and cost-effectiveness are achieved, but thermal conductivity is low (0.1-0.4 W·m−1·K−1) causing severe thermal aggregation, fluorescence saturation, and quenching under high power density laser irradiation

Engineering Contradiction:
Improveluminous efficiencyVSAvoidthermal aggregation
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The patent employs a composite encapsulation structure combining inorganic fluorescent glass particles with organic encapsulation materials. The inorganic glass particles serve as the fluorescent conversion medium while the organic material provides structural integrity and thermal management. This composite approach leverages the high thermal conductivity of inorganic materials to dissipate heat while maintaining the beneficial properties of organic encapsulants, thereby reducing thermal aggregation and fluorescence quenching under high power density laser irradiation

Inventive Principle:
Principle #40Composite materials

2Power

If laser power density is increased to achieve ultra-high-power and high-brightness illumination, then projection distance and safety are improved, but thermal aggregation effect becomes severe causing fluorescence saturation and quenching

Engineering Contradiction:
Improveoptical power densityVSAvoidfluorescence stability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent modifies the thermal and optical parameters of the encapsulation system by introducing inorganic fluorescent glass particles with controlled size distributions and thermal conductivity characteristics. This parameter change enables the system to withstand higher power densities by improving heat dissipation capacity while maintaining fluorescence stability, thus allowing ultra-high-power illumination without severe thermal aggregation effects

Inventive Principle:
Principle #35Parameter changes

3Use of energy by moving object

If blue LED chips are used for white light generation, then high luminous efficiency and long service life are achieved, but efficiency droop occurs when injection current rises to certain threshold

Engineering Contradiction:
Improveluminous efficiencyVSAvoidinjection current
Core Design Contradiction:
Use of energy by moving objectVSPower

Solution Approach 1:

The patent replaces the LED chip's direct white light generation mechanism with a laser excitation-based fluorescent conversion system. Instead of relying on blue LED chips that suffer from efficiency droop at high currents, the system uses a blue laser diode to excite fluorescent glass particles, which then emit broad-spectrum light that is converted to white light. This substitution eliminates the efficiency droop problem inherent in high-power LED operation while achieving ultra-high-power and high-brightness illumination

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If all-inorganic fluorescent conversion materials (fluorescent glass) are used to improve aging resistance and chemical stability, then resistance to laser irradiation is enhanced, but thermal conductivity remains low causing excessive operating temperature and fluorescence saturation

Engineering Contradiction:
Improveaging resistanceVSAvoidoperating temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies local quality optimization by creating a multi-component encapsulation system where different materials serve specific functions: inorganic fluorescent glass particles provide aging resistance and chemical stability, while the organic encapsulation matrix provides thermal pathways and structural support. This localized functional distribution allows the system to maintain low operating temperatures through improved heat dissipation while preserving the superior aging resistance of inorganic materials

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multilayer-structured fluorescent wafer achieves higher luminous efficiency, increased fluorescence saturation threshold, and improved thermal conductivity, making it suitable for high-power density laser lighting and display applications.

Implementation Method 1

a metal reflective film layer... enhances luminous efficiency through reflective optimization

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

improves thermal conductivity and heat dissipation using high-purity silver paste

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Laser lighting is generated by excitation of fluorescent conversion materials using blue light LD to produce white light

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Data Source

PatentUS12304172B1Multilayered fluorescent wafer for laser lighting and display, and method of manufacturing
Publication Date: 2025.05.20 CHINA JILIANG UNIV
  • US12304172B1 patent drawing
  • US12304172B1 patent drawing
  • US12304172B1 patent drawing

AI summary

The multilayered fluorescent wafer includes a fluorescent glass layer, a metal reflective film layer with high reflectivity, a sealing silver paste layer with high thermal conductivity, and a metal substrate layer, the layers disposed sequentially from top to bottom.