Multi-Zone Heat Dissipation Structure for Differential Temperature Control
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Solution Overview
Problem
Existing electronic devices with heat dissipation structures can only control multiple components to a single target temperature, limiting their effectiveness in managing diverse thermal requirements of different components within the device.
Innovation Solution
A heat dissipation structure comprising a refrigerator and a heat dissipation device that form separate heat dissipation channels for components requiring different target temperatures, with an intermediate conductive surface to manage temperature ranges, allowing for independent control of multiple elements to specific temperature ranges or values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat dissipation structure is used for multiple components, then the device complexity is reduced, but the temperature control precision for each component deteriorates
Solution Approach 1:
The heat dissipation structure is segmented into multiple independent heat dissipation channels, each dedicated to specific components with similar thermal requirements. This segmentation allows each channel to be optimized for its target components while maintaining overall system simplicity through modular design.
Solution Approach 2:
Different heat dissipation channels are designed with locally optimized properties (such as different thermal conductivities, surface areas, or cooling methods) to match the specific thermal requirements of different component groups, enabling precise temperature control for each local region.
2Manufacturing precision
If separate heat dissipation channels are created for different temperature requirements, then the temperature control precision is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation system incorporates universal components that can serve multiple functions across different channels. For example, a common heat sink structure may serve multiple LED types, or a single control system may manage multiple temperature zones, reducing overall complexity despite having separate channels.
Solution Approach 2:
Heat dissipation channels are designed with nested or hierarchical structures where smaller cooling elements are integrated within larger cooling systems. This nesting allows multiple temperature control functions to be achieved within a compact, unified structure rather than requiring completely separate systems.
3Adaptability or versatility
If multiple heat dissipation channels are implemented, then the adaptability to different thermal requirements is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The modular segmented design allows each heat dissipation channel to be manufactured and tested independently, then assembled into the final system. This segmentation improves adaptability to different thermal requirements while facilitating easier manufacturing through standardized modules.
Solution Approach 2:
The system allows for parameter adjustments (such as thermal conductivity, surface area, or cooling flow rate) in each channel to adapt to different thermal requirements. These parameter changes can be achieved through standardized component selections rather than custom manufacturing, maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and stable temperature control for multiple components within an electronic device, such as light emitting diodes, by adjusting the number and configuration of refrigerators and heat dissipation devices to achieve various target temperatures, enhancing thermal management efficiency.
Implementation Method 1
a heat dissipation structure comprising a refrigerator and a heat dissipation device that form separate heat dissipation channels for components requiring different target temperatures
Implementation Method 2
an intermediate conductive surface to manage temperature ranges
Data Source
AI summary
A heat dissipation structure capable of holding different components at different temperatures within one housing includes at least first and second elements, a refrigerator, and a heat dissipation device. The refrigerator is positioned adjacent to the first element. The refrigerator forms a first heat dissipation channel to dissipate heat from the first element requiring a first target temperature. The dissipation device forms a second heat dissipation channel to dissipate heat from the second element requiring a second target temperature, the first target temperature being higher than the second target temperature.